Heterogeneous Integrated Failure Analysis Using RF Signal Detection/Injection with Power Spectrum Analysis
Abstract not provided.
Abstract not provided.
Understanding the age of semiconductor parts being built into devices and systems is of interest for manufacturing quality control. Power spectrum analysis (PSA) is a fast, non-destructive, sensitive method for examining semiconductor parts. This talk will cover the use of multivariate analysis on both PSA data and conventional current-voltage data generated prior to PSA analysis to create algorithms that can be automated to screen semiconductor parts for aging.
Abstract not provided.
In this work we present a novel method for improving the high-temperature performance of silicon photomultipliers (SiPMs) via focused ion beam (FIB) modification of individual microcells. The literature suggests that most of the dark count rate (DCR) in a SiPM is contributed by a small percentage (<5%) of microcells. By using a FIB to electrically deactivate this relatively small number of microcells, we believe we can greatly reduce the overall DCR of the SiPM at the expense of a small reduction in overall photodetection efficiency, thereby improving its high temperature performance. In this report we describe our methods for characterizing the SiPM to determine which individual microcells contribute the most to the DCR, preparing the SiPM for FIB, and modifying the SiPM using the FIB to deactivate the identified microcells.