Publications

This study investigates the application of microbeads as an innovative encapsulation technique to protect electronic components from harsh mechanical strain. Traditional encapsulation methods using hard epoxy provide substantial mechanical support but create thermal expansion mismatch issues, potentially leading to electronic component failure. We explore the use of finely powdered microbeads to achieve protective structures combining stiffness and energy absorption. The research focuses on key variables, including microbead size, microbead roughness, compaction of microbeads, and circuit board mounting in the encapsulation, all of which influence the encapsulation’s effectiveness. Experimental setups and testing protocols were developed to assess the performance of various microbead materials under different impact conditions. Results demonstrate that microbead encapsulation significantly reduces strain on circuit boards, minimizing the risk of damage during mechanical shocks. However, challenges remain, such as optimizing microbead characteristics and modeling their behavior within large-scale circuit board assemblies. Despite these challenges, the findings suggest that microbead encapsulation offers a promising alternative to conventional methods, enhancing the durability and reliability of electronic components in high-stress environments.

Abstract not provided.

Creation of a Sandia internally developed, shock-hardened Recoverable Data Recorder (RDR) necessitated experimentation by ballistically-firing the device into water targets at velocities up to 5,000 ft/s. The resultant mechanical environments were very severe—routinely achieving peak accelerations in excess of 200 kG and changes in pseudo-velocity greater than 38,000 inch/s. High-quality projectile deceleration datasets were obtained though high-speed imaging during the impact events. The datasets were then used to calibrate and validate computational models in both CTH and EPIC. Hydrodynamic stability in these environments was confirmed to differ from aerodynamic stability; projectile stability is maintained through a phenomenon known as “tail-slapping” or impingement of the rear of the projectile on the cavitation vapor-water interface which envelopes the projectile. As the projectile slows the predominate forces undergo a transition which is outside the codes’ capabilities to calculate accurately, however, CTH and EPIC both predict the projectile trajectory well in the initial hypervelocity regime. Stable projectile designs and the achievable acceleration space are explored through a large parameter sweep of CTH simulations. Front face chamfer angle has the largest influence on stability with low angles being more stable.

Creation of a Sandia internally developed, shock-hardened Recoverable Data Recorder (RDR) necessitated experimentation by ballistically-firing the device into water targets at velocities up to 5,000 ft/s. The resultant mechanical environments were very severe—routinely achieving peak accelerations in excess of 200 kG and changes in pseudo-velocity greater than 38,000 inch/s. High-quality projectile deceleration datasets were obtained though high-speed imaging during the impact events. The datasets were then used to calibrate and validate computational models in both CTH and EPIC. Hydrodynamic stability in these environments was confirmed to differ from aerodynamic stability; projectile stability is maintained through a phenomenon known as “tail-slapping” or impingement of the rear of the projectile on the cavitation vapor-water interface which envelopes the projectile. As the projectile slows the predominate forces undergo a transition which is outside the codes’ capabilities to calculate accurately, however, CTH and EPIC both predict the projectile trajectory well in the initial hypervelocity regime. Stable projectile designs and the achievable acceleration space are explored through a large parameter sweep of CTH simulations. Front face chamfer angle has the largest influence on stability with low angles being more stable.

Abstract not provided.

Abstract not provided.