Hierarchal Polynomial Wavelet Decomposition for Full-Field Material Calibration
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Sandia National Laboratories has tested and evaluated a new version of the Chaparral 64S infrasound sensor, designed and manufactured by Chaparral Physics. The purpose of this infrasound sensor evaluation is to measure the performance characteristics in such areas as power consumption, sensitivity, full scale, self-noise, dynamic range, response, passband, sensitivity variation due to changes in barometric pressure and temperature, and sensitivity to acceleration. The Chaparral 64S infrasound sensors are being evaluated for use in the International Monitoring System (IMS) of the Preparatory Commission to the Comprehensive Nuclear-Test-Ban Treaty Organization (CTBTO).
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Journal of Nuclear Materials
Comprehensive molecular dynamics tensile test simulations have been performed to study the delamination processes of seven different grain boundaries / cleavage planes (Σ1{111}, Σ3{111}, Σ5{100}, Σ7{111}, Σ9{411}, Σ11{311}, and R{100}/{411}) containing a helium bubble. Combinations of a variety of conditions are explored including different strain rates, system dimensions, bubble density, bubble radius, bubble pressure, and temperature. We found that in general, grain boundaries absorb less energies with decreasing strain rate but increasing bubble areal density, bubble pressure, bubble radius, and temperature. The propensity of grain boundary delamination is sensitive to grain boundary type: The random grain boundary R{100}/{411} is one of the most brittle boundaries whereas the Σ1{111} cleavage plane and the Σ3{111} twin boundary are two of the toughest boundaries. The sorted list of grain boundary fracture vulnerability obtained from our dynamic tensile test simulations differs from the one obtained from our decohesion energy calculations, confirming the important role of plastic deformation during fracture. Detailed mechanistic analyses are performed to interpret the simulated results.
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