Publications

High-power electronics are central in the development of radar, solid-state lighting, and laser systems. Large powers, however, necessitate improved heat dissipation as heightened temperatures deleteriously affect both performance and reliability. Heat dissipation, in turn, is determined by the cascade of energy from the electronic to lattice system. Full characterization of the transport then requires analysis of each. In response, this four-month late start effort has developed a transient thermoreflectance (TTR) capability that probes the thermal response of electronic carriers with 100 fs resolution. Simultaneous characterization of the lattice carriers with this electronic assessment was then investigated by equipping the optical arrangement to acquire a Raman signal from radiation discarded during the TTR experiment. Initial results show only tentative acquisition of a Raman response at these timescales. Using simulations of the response, challenges responsible for these difficulties are then examined and indicate that with outlined refinements simultaneous acquisition of TTR/Raman signals remains attainable in the near term.

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Due to the coupling of thermal and mechanical behaviors at small scales, a Campaign 6 project was created to investigate thermomechanical phenomena in microsystems. This report documents experimental measurements conducted under the auspices of this project. Since thermal and mechanical measurements for thermal microactuators were not available for a single microactuator design, a comprehensive suite of thermal and mechanical experimental data was taken and compiled for model validation purposes. Three thermal microactuator designs were selected and fabricated using the SUMMiT V{sup TM} process at Sandia National Laboratories. Thermal and mechanical measurements for the bent-beam polycrystalline silicon thermal microactuators are reported, including displacement, overall actuator electrical resistance, force, temperature profiles along microactuator legs in standard laboratory air pressures and reduced pressures down to 50 mTorr, resonant frequency, out-of-plane displacement, and dynamic displacement response to applied voltages.

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This report documents technical work performed to complete the ASC Level 2 Milestone 2841: validation of thermal models for a prototypical MEMS thermal actuator. This effort requires completion of the following task: the comparison between calculated and measured temperature profiles of a heated stationary microbeam in air. Such heated microbeams are prototypical structures in virtually all electrically driven microscale thermal actuators. This task is divided into four major subtasks. (1) Perform validation experiments on prototypical heated stationary microbeams in which material properties such as thermal conductivity and electrical resistivity are measured if not known and temperature profiles along the beams are measured as a function of electrical power and gas pressure. (2) Develop a noncontinuum gas-phase heat-transfer model for typical MEMS situations including effects such as temperature discontinuities at gas-solid interfaces across which heat is flowing, and incorporate this model into the ASC FEM heat-conduction code Calore to enable it to simulate these effects with good accuracy. (3) Develop a noncontinuum solid-phase heat transfer model for typical MEMS situations including an effective thermal conductivity that depends on device geometry and grain size, and incorporate this model into the FEM heat-conduction code Calore to enable it to simulate these effects with good accuracy. (4) Perform combined gas-solid heat-transfer simulations using Calore with these models for the experimentally investigated devices, and compare simulation and experimental temperature profiles to assess model accuracy. These subtasks have been completed successfully, thereby completing the milestone task. Model and experimental temperature profiles are found to be in reasonable agreement for all cases examined. Modest systematic differences appear to be related to uncertainties in the geometric dimensions of the test structures and in the thermal conductivity of the polycrystalline silicon test structures, as well as uncontrolled nonuniform changes in this quantity over time and during operation.

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Optical actuators are fundamental building blocks in the development of all-optical microelectromechanical devices. Photothermally actuated devices are inevitably limited by overheating and device damage resulting from the absorption of laser power. Optimal actuator design requires an efficient use of the applied laser power while minimizing the susceptibility of device damage. Surface micromachined polycrystalline silicon flexure-style optical actuators, which are powered using an 808-nm continuous-wave laser, were evaluated for displacement performance and susceptibility to damage. Actuator displacement is linear with incident power for laser powers below those that cause damage to the irradiated surface, up to a maximum displacement of 7-9 μm. Damage of the irradiated surface causes viscous relaxation of the polysilicon film and leads to recession of the displacement during the heating and additional recession after the optical power is removed. The first spatially resolved temperature measurements during device operation were obtained using micro-Raman thermometry. The temperature measurements revealed the influence of temperature-dependent optical properties in the thermal behavior of the irradiated devices. © 2008 IEEE.

Optically powered devices are typically irradiated by high intensity lasers and rely on the temperature excursion generated by the laser for operation. While numerical modeling can estimate the temperature profile of the irradiated devices, only direct measurements can determine the actual device temperatures. Available surface thermometry techniques, such as infrared imaging, scanning thermal microscopy and thermoreflectance are generally incompatible with an optical powering scheme, the micron-scale layer thicknesses of microsystem devices, or both. In this paper we discuss the use of micro-Raman thermometry to obtain the first spatiallyresolved temperature measurements of various polycrystalline silicon (polysilicon) surfaces heated with an 808 nm continuous wave (CW) laser at a 60° angle of incidence. The micron-scale resolution of the micro-Raman technique permitted mapping of the surface temperature in the vicinity of the heating laser spot and throughout the device. In addition to discussing the requirements for accurate data collection, the implications of optical interference on the heated structures are also considered. Copyright © 2007 by ASME.

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Analysis of the Raman Stokes peak position and its shift has been frequently used to estimate either temperature or stress in microelectronics and microelectromechanical system devices. However, if both fields are evolving simultaneously, the Stokes shift represents a convolution of these effects, making it difficult to measure either quantity accurately. By using the relative independence of the Stokes linewidth to applied stress, it is possible to deconvolve the signal into an estimation of both temperature and stress. Using this property, a method is presented whereby the temperature and stress were simultaneously measured in doped polysilicon microheaters. A data collection and analysis method was developed to reduce the uncertainty in the measured stresses resulting in an accuracy of ±40 MPa for an average applied stress of -325 MPa and temperature of 520 °C. Measurement results were compared to three-dimensional finite-element analysis of the microheaters and were shown to be in excellent agreement. This analysis shows that Raman spectroscopy has the potential to measure both evolving temperature and stress fields in devices using a single optical measurement. © 2007 American Institute of Physics.

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We describe a Laboratory Directed Research and Development (LDRD) effort to develop and apply laser-based thermometry diagnostics for obtaining spatially resolved temperature maps on working microelectromechanical systems (MEMS). The goal of the effort was to cultivate diagnostic approaches that could adequately resolve the extremely fine MEMS device features, required no modifications to MEMS device design, and which did not perturb the delicate operation of these extremely small devices. Two optical diagnostics were used in this study: microscale Raman spectroscopy and microscale thermoreflectance. Both methods use a low-energy, nonperturbing probe laser beam, whose arbitrary wavelength can be selected for a diffraction-limited focus that meets the need for micron-scale spatial resolution. Raman is exploited most frequently, as this technique provides a simple and unambiguous measure of the absolute device temperature for most any MEMS semiconductor or insulator material under steady state operation. Temperatures are obtained from the spectral position and width of readily isolated peaks in the measured Raman spectra with a maximum uncertainty near {+-}10 K and a spatial resolution of about 1 micron. Application of the Raman technique is demonstrated for V-shaped and flexure-style polycrystalline silicon electrothermal actuators, and for a GaN high-electron-mobility transistor. The potential of the Raman technique for simultaneous measurement of temperature and in-plane stress in silicon MEMS is also demonstrated and future Raman-variant diagnostics for ultra spatio-temporal resolution probing are discussed. Microscale thermoreflectance has been developed as a complement for the primary Raman diagnostic. Thermoreflectance exploits the small-but-measurable temperature dependence of surface optical reflectivity for diagnostic purposes. The temperature-dependent reflectance behavior of bulk silicon, SUMMiT-V polycrystalline silicon films and metal surfaces is presented. The results for bulk silicon are applied to silicon-on-insulator (SOI) fabricated actuators, where measured temperatures with a maximum uncertainty near {+-}9 K, and 0.75-micron inplane spatial resolution, are achieved for the reflectance-based measurements. Reflectance-based temperatures are found to be in good agreement with Raman-measured temperatures from the same device.

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The response of microsystem components to laser irradiation is relevant to the use of laser processing, optical diagnostics, and optical microelectromechanical systems (MEMS) device design and performance. The dimensions of MEMS are on the same order as infrared laser wavelengths which results in interference phenomena when the parts are partially transparent. Four distinct polycrystalline structures were designed and irradiated with 808 nm laser light to determine the effect of layers and the presence of a substrate via on the laser power threshold for damage. The presence of a substrate via resulted in lower damage thresholds, and interference phenomena resulted in a single layer structure having the highest damage threshold.

Optical actuation is a necessity for the development of all-optical MEMS devices. Optically-powered actuators relying on a photothermal process are limited by overheating and structural damage resulting from the absorption of laser power. Surface micromachined polycrystalline silicon (polysilicon) optical actuators, powered using an 808 nm continuous wave laser, were evaluated for displacement performance and susceptibility to damage. The tested actuators were of a flexure-type design fabricated from either a single 2.25 μm polysilicon layer or a 4.5 μm polysilicon laminate layer, and in three different designs. Displacement of the actuators was linear with power for all tested designs for powers below those that cause damage to the irradiated surface. Maximum displacement observed was in the 7-9 μm range regardless of actuator design. After surface damage is initiated, displacement of the actuator during irradiation recedes in all actuators, with actuators with a 50 μm-wide target surface exhibiting complete recession in their displacement. The return position of the actuators after the irradiated surface has damaged also exhibits recession on the order of 4-5 μm for surfaces damaged with up to 650 mW. Exposing the actuator surfaces to longer irradiation times had no effect on the displacement if the surface had no damage, but resulted in regression of the displacement as the irradiation time increased if the surface had preexisting damage. Copyright © 2006 by ASME.

Optical MEMS devices are commonly interfaced with lasers for communication, switching, or imaging applications. Dissipation of the absorbed energy in such devices is often limited by dimensional constraints which may lead to overheating and damage of the component. Surface micromachined, optically powered thermal actuators fabricated from two 2.25 μm thick polycrystalline silicon layers were irradiated with 808 nm continuous wave laser light with a 100 μm diameter spot under increasing power levels to assess their resistance to laser-induced damage. Damage occurred immediately after laser irradiation at laser powers above 275 mW and 295 mW for 150 urn diameter circular and 194 urn by 150 μm oval targets, respectively. At laser powers below these thresholds, the exposure time required to damage the actuators increased linearly and steeply as the incident laser power decreased. Increasing the area of the connections between the two polycrystalline silicon layers of the actuator target decreases the extent of the laser damage. Additionally, an optical thermal actuator target with 15 μm × 15 μm posts withstood 326 mW for over 16 minutes without exhibiting damage to the surface. Copyright © 2005 by ASME.

Optical MEMS devices are commonly interfaced with lasers for communication, switching, or imaging applications. Dissipation of the absorbed energy in such devices is often limited by dimensional constraints which may lead to overheating and damage of the component. Surface micromachined, optically powered thermal actuators fabricated from two 2.25 μm thick polycrystalline silicon layers were irradiated with 808 nm continuous wave laser light with a 100 μm diameter spot under increasing power levels to assess their resistance to laser-induced damage. Damage occurred immediately after laser irradiation at laser powers above 275 mW and 295 mW for 150 urn diameter circular and 194 urn by 150 μm oval targets, respectively. At laser powers below these thresholds, the exposure time required to damage the actuators increased linearly and steeply as the incident laser power decreased. Increasing the area of the connections between the two polycrystalline silicon layers of the actuator target decreases the extent of the laser damage. Additionally, an optical thermal actuator target with 15 μm × 15 μm posts withstood 326 mW for over 16 minutes without exhibiting damage to the surface. Copyright © 2005 by ASME.