Publications

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When diethanolamine (DEA) is used as a curative for a DGEBA epoxy, a rapid “adduct-forming” reaction of epoxide with the secondary amine of DEA is followed by a slow “gelation” reaction of epoxide with hydroxyl and with other epoxide. Through an extensive review of previous investigations of simpler, but chemically similar, reactions, it is deduced that at low temperature the DGEBA/DEA gelation reaction is “activated” (shows a pronounced induction time, similar to autocatalytic behavior) by the tertiary amine in the adduct. At high temperature, the activated nature of the reaction disappears. The impact of this mechanism change on the kinetics of the gelation reaction, as resolved with differential scanning calorimetry, infrared spectroscopy, and isothermal microcalorimetry, is presented. It is shown that the kinetic characteristics of the gelation-reaction of the DGEBA/DEA system are similar to other tertiary-amine activated epoxy reactions and consistent with the anionic polymerization model previously proposed for this class of materials. Principle results are the time-temperature-transformation diagram, the effective activation energy, and the upper stability temperature of the zwitterion initiator of the activated gelation reaction. It is established that the rate of epoxide consumption cannot be generically represented as a function only of temperature and degree of epoxy conversion. The complex chemistry active in the material requires specific consideration of the dilute intermediates in the reaction sequence in order to define a model of the reaction kinetics applicable to all time-temperature cure histories.

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A viscoelastic constitutive analysis is used to investigate the counter-intuitive observation of “mobility decrease with increased deformation through yield” in a glass forming polymer under compressive and tensile loading conditions. Current Sandia National Laboratory polymer models are built on the assumption that deformation enhances the mobility of the material. If this assumption is not true at small strain rates (e.g., thermal fluctuations in stockpile storage) then models will not be able to accurately predict stress evolution and potential failure of components during stockpile storage. The behavior of an epoxy thermoset is explored using an extensively validated material “clock” model, the Simplified Potential Energy Clock (SPEC) model. This methodology allows for a comparison between the linear viscoelastic (LVE) limit and the true non-linear viscoelastic (NLVE) representation and enables exploration of a wide range of conditions that are not practical to explore experimentally. The model predicts the behavior described as “mobility decrease with increased deformation” in the LVE limit and at low strain rates for NLVE. Only when loading rates are sufficient to decrease the material shift factor by multiple orders of magnitude is the anticipated deformation induced mobility or “mobility increase with increased deformation” observed. While the model has not been “trained” for these behaviors, it also predicts that the normalized stress relaxation response is indistinguishable amongst strain levels in the “post-yield” region as has been experimentally reported. At long time, which has not been examined experimentally, the model predicts the normalized relaxation curves “crossover” and return to the LVE ordering. These findings further demonstrate the ability of rheologically simple models to represent experimentally measured material response and present predictions at long time scales that could be tested experimentally.

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When thermosetting polymers are used to bond or encapsulate electrical, mechanical or optical assemblies, residual stress, which often affects the performance and/or reliability of these devices, develops within the structure. The Thin-Disk-on-Cylinder structural response test is demonstrated as a powerful tool to design epoxy encapsulant cure schedules to reduce residual stress, even when all the details of the material evolution during cure are not explicitly known. The test's ability to (1) distinguish between cohesive and adhesive failure modes and (2) demonstrate methodologies to eliminate failure and reduce residual stress, make choices of cure schedules that optimize stress in the encapsulant unambiguous. For the 828/DEA/GMB material in the Thin-Disk-on-Cylinder geometry, the stress associated with cure is significant and outweighs that associated with cool down from the final cure temperature to room temperature (for measured lid strain, Iε_cureI > Iε_thermalI). The difference between the final cure temperature and the temperature at which the material gels, T_f-T_gel, was demonstrated to be a primary factor in determining the residual stress associated with cure. Increasing T_f-T_gel leads to a reduction in cure stress that is described as being associated with balancing some of the 828/DEA/GMB cure shrinkage with thermal expansion. The ability to tune residual stress associated with cure by controlling T_f-T_gel would be anticipated to translate to other thermosetting encapsulation materials, but the times and temperatures appropriate for a given material may vary widely.

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The performance and reliability of many mechanical and electrical components depend on the integrity of po lymer - to - solid interfaces . Such interfaces are found in adhesively bonded joints, encapsulated or underfilled electronic modules, protective coatings, and laminates. The work described herein was aimed at improving Sandia's finite element - based capability to predict interfacial crack growth by 1) using a high fidelity nonlinear viscoelastic material model for the adhesive in fracture simulations, and 2) developing and implementing a novel cohesive zone fracture model that generates a mode - mixity dependent toughness as a natural consequence of its formulation (i.e., generates the observed increase in interfacial toughness wi th increasing crack - tip interfacial shear). Furthermore, molecular dynamics simulations were used to study fundamental material/interfa cial physics so as to develop a fuller understanding of the connection between molecular structure and failure . Also reported are test results that quantify how joint strength and interfacial toughness vary with temperature.

The degradation in the strength of napkin-ring (NR) joints bonded with an epoxy thermoset is evaluated in a humid environment. While adherend composition (stainless steel and aluminum) and surface preparation (polished, grit blasted, primed, coupling agent coated) do not affect virgin (time=0) joint strength, they can significantly affect the role of moisture on the strength of the joint. Adherend surface abrasion and corrosion processes are found to be key factors in determining the reliability of joint strength in humid environments. In cases where surface specific joint strength degradation processes are not active, decreases in joint strength can be accounted for by the glass transition temperature, Tg, depression of the adhesive associated with water sorption. Under these conditions, joint strength can be rejuvenated to virgin strength by drying. In addition, the decrease in joint strength associated with water sorption can be predicted by the Simplified Potential Energy Clock (SPEC) model by shifting the adhesive reference temperature, Tref, by the same amount as the Tg depression. When surface specific degradation mechanisms are active, they can reduce joint strength below that associated with adhesive Tg depression, and joint strength is not recoverable by drying. A critical relative humidity (or, potentially, critical water sorption concentration), below which the surface specific degradation does not occur, appears to exist for the polished stainless steel joints.

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