This document summarizes the work done in our three-year LDRD project titled 'Physics of Intense, High Energy Radiation Effects.' This LDRD is focused on electrical effects of ionizing radiation at high dose-rates. One major thrust throughout the project has been the radiation-induced conductivity (RIC) produced by the ionizing radiation. Another important consideration has been the electrical effect of dose-enhanced radiation. This transient effect can produce an electromagnetic pulse (EMP). The unifying theme of the project has been the dielectric function. This quantity contains much of the physics covered in this project. For example, the work on transient electrical effects in radiation-induced conductivity (RIC) has been a key focus for the work on the EMP effects. This physics in contained in the dielectric function, which can also be expressed as a conductivity. The transient defects created during a radiation event are also contained, in principle. The energy loss lead the hot electrons and holes is given by the stopping power of ionizing radiation. This information is given by the inverse dielectric function. Finally, the short time atomistic phenomena caused by ionizing radiation can also be considered to be contained within the dielectric function. During the LDRD, meetings about the work were held every week. These discussions involved theorists, experimentalists and engineers. These discussions branched out into the work done in other projects. For example, the work on EMP effects had influence on another project focused on such phenomena in gases. Furthermore, the physics of radiation detectors and radiation dosimeters was often discussed, and these discussions had impact on related projects. Some LDRD-related documents are now stored on a sharepoint site (https://sharepoint.sandia.gov/sites/LDRD-REMS/default.aspx). In the remainder of this document the work is described in catergories but there is much overlap between the atomistic calculations, the continuum calculations and the experiments.
Negative bias temperature instability is an issue of critical importance as the space electronics industry evolves because it may dominate the reliability lifetime. Understanding its physical origin is therefore essential in determining how best to search for methods of mitigation. It has been suggested that the magnitude of the effect is strongly dependent on circuit operation conditions (static or dynamic modes). In the present work, we examine the time constants related to the charging and recovery of trapped charged induced by NBTI in HfSiON gate dielectric devices. In previous work, we avoided the issue of charge relaxation during acquisition of the I{sub ds}(V{sub gs}) curve by invoking a continuous stressing technique whereby {Delta}V{sub th} was extracted from a series of single point I{sub ds} measurements. This method relied heavily on determination of the initial value of the source-drain current (I{sub ds}{sup o}) prior to application of gate-source stress. In the present work we have used a new pulsed measurement system (Keithley SCS 4200-PIV) which not only removes this uncertainty but also permits dynamic measurements in which devices are AC stressed (Fig. 1a) or subjected to cycles of continued DC stresses followed by relaxation (Fig. 1b). We can now examine the charging and recovery characteristics of NBTI with higher precision than previously possible. We have performed NBTI stress experiments at room temperature on p-channel MOSFETs made with HfSiON gate dielectrics. In all cases the devices were stressed in the linear regime with V{sub ds}=-0.1V. We have defined two separate waveforms/pulse trains as illustrated in Fig 1. These were applied to the gate of the MOSFET. Firstly we examined the charging characteristics by applying an AC stress at 2.5MHz or 10Hz for different times. For a 50% duty cycle this corresponded to V{sub gs} = - 2V pulses for 200ns or 500ms followed by V{sub gs} = 0V pulses for 200ns or 500ms recovery respectively. In between 'bursts' of AC stress cycles, the I{sub ds}(V{sub gs}) characteristic in the range (-0.6V, -1.3V) was measured in 10.2 {micro}s. V{sub th} was extracted directly from this curve, or from a single I{sub ds} point normalized to the initial I{sub ds}{sup o} using our previous method. The resulting I{sub ds}/I{sub ds}{sup o} curves are compared; in Fig 2, the continuous stress results are included. In the second method, we examined the recovery dynamic by holding V{sub gs} = 0V for a finite amount of time (range 100 ns to 100 ms) following stress at V{sub gs} = - 2V for various times. In Fig 3 we compare |{Delta}V{sub th}(t)| results for recovery times of 100ms, 1ms, 100{micro}s, 50{micro}s, 25{micro}s, 10{micro}s, 100ns, and DC (i.e. no recovery) The data in Fig 2 shows that with a high frequency stress (2.5MHz) devices undergo significantly less (but finite) current degradation than devices stressed at 10Hz. This appears to be limited by charging and not by recovery. Fig 3 supports this hypothesis since for 100ns recovery periods, only a small percentage of the trapped charge relaxes. Detailed explanation of these experiments will be presented at the conference.
Electronic components such as bipolar junction transistors (BJTs) are damaged when they are exposed to radiation and, as a result, their performance can significantly degrade. In certain environments the radiation consists of short, high flux pulses of neutrons. Electronics components have traditionally been tested against short neutron pulses in pulsed nuclear reactors. These reactors are becoming less and less available; many of them were shut down permanently in the past few years. Therefore, new methods using radiation sources other than pulsed nuclear reactors needed to be developed. Neutrons affect semiconductors such as Si by causing atomic displacements of Si atoms. The recoiled Si atom creates a collision cascade which leads to displacements in Si. Since heavy ions create similar cascades in Si we can use them to create similar damage to what neutrons create. This LDRD successfully developed a new technique using easily available particle accelerators to provide an alternative to pulsed nuclear reactors to study the displacement damage and subsequent transient annealing that occurs in various transistor devices and potentially qualify them against radiation effects caused by pulsed neutrons.
Germanium telluride undergoes rapid transition between polycrystalline and amorphous states under either optical or electrical excitation. While the crystalline phases are predicted to be semiconductors, polycrystalline germanium telluride always exhibits p -type metallic conductivity. We present a study of the electronic structure and formation energies of the vacancy and antisite defects in both known crystalline phases. We show that these intrinsic defects determine the nature of free-carrier transport in crystalline germanium telluride. Germanium vacancies require roughly one-third the energy of the other three defects to form, making this by far the most favorable intrinsic defect. While the tellurium antisite and vacancy induce gap states, the germanium counterparts do not. A simple counting argument, reinforced by integration over the density of states, predicts that the germanium vacancy leads to empty states at the top of the valence band, thus giving a complete explanation of the observed p -type metallic conduction.