Publications

Walker, Charles A.; Schwindt, Peter S.; Lee, Jongmin L.; De Smet, Dennis J.; Johnson, Lawrence A.; Biederman, Grant B.

Abstract not provided.

Armijo, Kenneth M.; Johnson, Lawrence A.; Walker, Charles A.; Andraka, Charles E.; Scott, James A.; De Smet, Dennis J.; Kinney, Peter G.; Hoff, Brad H.; Baros, Anthony B.; Savrun, Ender S.

Abstract not provided.

Arata, Edward R.; Walker, Charles A.; Johnson, Lawrence A.; De Smet, Dennis J.

Abstract not provided.

Armijo, Kenneth M.; Johnson, Lawrence A.; Andraka, Charles E.; Scott, James A.; De Smet, Dennis J.; Hoff, Brad H.; Baros, Anthony B.; Savrun, Ender S.

Abstract not provided.

Walker, Charles A.; Schwindt, Peter S.; Lee, Jongmin L.; De Smet, Dennis J.; Johnson, Lawrence A.; Biederman, Grant B.

Abstract not provided.

Armijo, Kenneth M.; Johnson, Lawrence A.; Andraka, C.E.A.; Scott, James A.; De Smet, Dennis J.; Kinney, Peter G.; Hoff, Bradley H.; Baros, Anthony B.

Abstract not provided.

Arata, Edward R.; Walker, Charles A.; Johnson, Lawrence A.; De Smet, Dennis J.

Abstract not provided.

Lee, Jongmin L.; McGuinness, Hayden J.; Soh, Daniel B.; Christensen, Justin C.; Ding, Roger D.; Finnegan, Patrick S.; Hoth, Gregory W.; Kindel, William K.; Little, Bethany J.; Rosenthal, Randy R.; Wendt, Joel R.; Lentine, Anthony L.; Eichenfield, Matthew S.; Gehl, M.; Kodigala, Ashok; Siddiqui, Aleem M.; Skogen, Erik J.; Vawter, Gregory A.; Ison, Aaron M.; Bossert, David B.; Fuerschbach, Kyle H.; Gillund, Daniel P.; Walker, Charles A.; De Smet, Dennis J.; Brashar, Connor B.; Berg, Joseph B.; Jhaveri, Prabodh M.; Smith, Tony G.; Kemme, S.A.; Schwindt, Peter S.; Biedermann, Grant B.

Abstract not provided.

Lee, Jongmin L.; Biedermann, Grant B.; McGuinness, Hayden J.; Soh, Daniel B.; Christensen, Justin C.; Ding, Roger D.; Finnegan, Patrick S.; Hoth, Gregory W.; Kindel, Will K.; Little, Bethany J.; Rosenthal, Randy R.; Wendt, J.R.; Lentine, Anthony L.; Eichenfield, Matthew S.; Gehl, M.; Kodigala, Ashok; Siddiqui, Aleem M.; Skogen, Erik J.; Vawter, Gregory A.; Ison, Aaron M.; Bossert, David B.; Fuerschbach, Kyle H.; Gillund, Daniel P.; Walker, Charles A.; De Smet, Dennis J.; Brashar, Connor B.; Berg, Joseph B.; Jhaveri, Prabodh M.; Smith, Tony G.; Kemme, S.A.; Schwindt, Peter S.

Abstract not provided.

Walker, Charles A.; De Smet, Dennis J.; Goeke, Ronald S.; McKenzie, Bonnie B.; Vianco, Paul T.

Abstract not provided.

Physical Review Accelerators and Beams

Douglass, Jonathan D.; Hutsel, Brian T.; Leckbee, Joshua L.; Mulville, Thomas D.; Stoltzfus, Brian S.; Savage, Mark E.; Breden, E.W.; Calhoun, Jacob D.; Cuneo, M.E.; De Smet, Dennis J.; Hohlfelder, Robert J.; Jaramillo, Deanna M.; Johns, Owen J.; Lombrozo, Aaron C.; Lucero, Diego J.; Moore, James M.; Porter, John L.; Radovich, S.; Sceiford, Matthew S.; Sullivan, Michael A.; Walker, Charles A.; Yazzie, Nicole T.

Here we present details of the design, simulation, and performance of a 100-GW linear transformer driver (LTD) cavity at Sandia National Laboratories. The cavity consists of 20 “bricks.” Each brick is comprised of two 80 nF, 100 kV capacitors connected electrically in series with a custom, 200 kV, three-electrode, field-distortion gas switch. The brick capacitors are bipolar charged to ±100 kV for a total switch voltage of 200 kV. Typical brick circuit parameters are 40 nF capacitance (two 80 nF capacitors in series) and 160 nH inductance. The switch electrodes are fabricated from a WCu alloy and are operated with breathable air. Over the course of 6,556 shots the cavity generated a peak electrical current and power of 1.03 MA (±1.8%) and 106 GW (±3.1%). Experimental results are consistent (to within uncertainties) with circuit simulations for normal operation, and expected failure modes including prefire and late-fire events. New features of this development that are reported here in detail include: (1) 100 ns, 1 MA, 100-GW output from a 2.2 m diameter LTD into a 0.1 Ω load, (2) high-impedance solid charging resistors that are optimized for this application, and (3) evaluation of maintenance-free trigger circuits using capacitive coupling and inductive isolation.

Walker, Charles A.; De Smet, Dennis J.; Goeke, Ronald S.; McKenzie, Bonnie B.; Vianco, Paul T.

Abstract not provided.

Welding Journal

Vianco, Paul T.; Walker, Charles A.; De Smet, Dennis J.; Kilgo, Alice C.; McKenzie, Bonnie B.; Grant, Richard P.

The run-out phenomenon was observed in Ag-Cu-Zr active braze joints made between the alumina ceramic and Kovar™ base material. Run-out introduces a significant yield loss by generating functional and/or cosmetic defects in brazements. A prior study identified a correlation between run-out and the aluminum (Al) released by the reduction/oxidation reaction with alumina and aluminum's reaction with the Kovar™ base material. A study was undertaken to understand the fundamental principles of run-out by examining the interface reaction between Ag-xAl filler metals (x = 2,5, and 10 wt-%) and Kovar™ base material. Sessile drop samples were fabricated using brazing temperatures of 965° (T769°F) or 995°C 0823°F) and times of 5 or 20 min. The correlation was made between the degree of wetting and spreading by the sessile drops and the run-out phenomenon. Wetting and spreading increased with Al content (x) of the. Ag-xAl filler metal, but was largely insensitive to the brazing process parameters. The increased Al concentration resulted in higher Al contents of the (Fe, Ni, Co)xAly reaction layer. Run-out was predicted when the filler metal has a locally elevated Al content exceeding 2-5 wt-%. Several mitigation strategies were proposed, based upon these findings.

Vianco, Paul T.; Walker, Charles A.; De Smet, Dennis J.; Kilgo, Alice C.; McKenzie, Bonnie B.; Kotula, Paul G.; Grant, Richard P.

Abstract not provided.

Walker, Charles A.; Bishop, Greg B.; De Smet, Dennis J.

Abstract not provided.

Vianco, Paul T.; Walker, Charles A.; De Smet, Dennis J.; Kilgo, Alice C.; McKenzie, Bonnie B.; Kotula, Paul G.; Grant, Richard P.

Abstract not provided.

Walker, Charles A.; Bishop, Greg B.; De Smet, Dennis J.

Abstract not provided.

Walker, Charles A.; De Smet, Dennis J.; Bishop, Greg B.; Allen, Amy A.; Brumbach, Michael T.; McKenzie, Bonnie B.

Abstract not provided.

Walker, Charles A.; McKenzie, Bonnie B.; Kilgo, Alice C.; Crenshaw, Thomas B.; De Smet, Dennis J.

Abstract not provided.

Walker, Charles A.; Bishop, Greg B.; Stokes, Robert N.; De Smet, Dennis J.

Abstract not provided.

Walker, Charles A.; Bishop, Greg B.; Stokes, Robert N.; De Smet, Dennis J.

Abstract not provided.

Walker, Charles A.; Romero, Juan A.; Stokes, Robert N.; De Smet, Dennis J.

Abstract not provided.

De Smet, Dennis J.; Patel, Kamlesh P.; Ho, Clifford K.; Rohde, Steven B.; Rohrer, Brandon R.; Okandan, Murat O.; Okandan, Murat O.; Spahn, Olga B.

Abstract not provided.

Rohde, Steven B.; Okandan, Murat O.; Pfeifer, Kent B.; De Smet, Dennis J.; Patel, Kamlesh P.; Ho, Clifford K.; Nordquist, Christopher N.; Walker, Charles A.; Rohrer, Brandon R.; Buerger, Stephen B.; Wroblewski, Brian W.

Low Temperature Cofired Ceramic (LTCC) has proven to be an enabling medium for microsystem technologies, because of its desirable electrical, physical, and chemical properties coupled with its capability for rapid prototyping and scalable manufacturing of components. LTCC is viewed as an extension of hybrid microcircuits, and in that function it enables development, testing, and deployment of silicon microsystems. However, its versatility has allowed it to succeed as a microsystem medium in its own right, with applications in non-microelectronic meso-scale devices and in a range of sensor devices. Applications include silicon microfluidic ''chip-and-wire'' systems and fluid grid array (FGA)/microfluidic multichip modules using embedded channels in LTCC, and cofired electro-mechanical systems with moving parts. Both the microfluidic and mechanical system applications are enabled by sacrificial volume materials (SVM), which serve to create and maintain cavities and separation gaps during the lamination and cofiring process. SVMs consisting of thermally fugitive or partially inert materials are easily incorporated. Recognizing the premium on devices that are cofired rather than assembled, we report on functional-as-released and functional-as-fired moving parts. Additional applications for cofired transparent windows, some as small as an optical fiber, are also described. The applications described help pave the way for widespread application of LTCC to biomedical, control, analysis, characterization, and radio frequency (RF) functions for macro-meso-microsystems.