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Doped contacts for high-longevity optically activated, high-gain gaas photoconductive Semiconductor Switches

IEEE Transactions on Plasma Science

Mar, Alan M.; Loubriel, Guillermo M.; Zutavern, Fred J.; O'Malley, Martin W.; Helgeson, Wesley D.; Brown, Darwin J.; Hjalmarson, Harold P.; Baca, A.G.

The longevity of high-gain GaAs photoconductive semiconductor switches (PCSS) has been extended to over 100 million pulses. This was achieved by improving the ohmic contacts through the incorporation of a doped layer that is very effective in the suppression of filament formation, alleviating current crowding. Damage-free operation is now possible at much higher current levels than before. The inherent damage-free current capacity of the bulk GaAs depends on the thickness of the doped layers and is at least 100 A for a dopant diffusion depth of 4 μm. This current could be increased by employing multiple switches connected in parallel. The contact metal has a different damage mechanism, and the threshold for damage (∼40-80 A) is not further improved beyond a dopant diffusion depth of about 2 μm. In a diffusion-doped contact switch, the switching performance is not degraded at the onset of contact metal erosion, unlike a switch with conventional contacts. For fireset applications operating at 1-kV/l-kA levels and higher, doped contacts have not yet resulted in improved longevity. We employ multifllament operation and InPb solder/Au ribbon wirebonding to demonstrate >100-shot lifetime at 1-kV/l-kA. © 2000 IEEE.

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Longevity improvement of optically activated, high gain GaAs photoconductive semiconductor switches

Mar, Alan M.; Loubriel, Guillermo M.; Zutavern, Fred J.; O'Malley, Martin W.; Helgeson, Wesley D.; Brown, Darwin J.; Hjalmarson, Harold P.; Baca, A.G.

The longevity of high gain GaAs photoconductive semiconductor switches (PCSS) has been extended to over 100 million pulses at 23A, and over 100 pulses at 1kA. This is achieved by improving the ohmic contacts by doping the semi-insulating GaAs underneath the metal, and by achieving a more uniform distribution of contact wear across the entire switch by distributing the trigger light to form multiple filaments. This paper will compare various approaches to doping the contacts, including ion implantation, thermal diffusion, and epitaxial growth. The device characterization also includes examination of the filament behavior using open-shutter, infra-red imaging during high gain switching. These techniques provide information on the filament carrier densities as well as the influence that the different contact structures and trigger light distributions have on the distribution of the current in the devices. This information is guiding the continuing refinement of contact structures and geometries for further improvements in switch longevity.

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2 Results