Publications

Abstract not provided.

Abstract not provided.

Advanced thin-film processing and packaging technologies are employed in the fabrication of new planar thin-film multijunction thermal converters (MJTCs). The processing, packaging, and design features build on experience gained from prior NIST demonstrations of thin-film converters and are optimized for improved sensitivity, bandwidth, manufacturability, and reliability.

New standards for ac current and voltage measurements, thin-film multifunction thermal converters (MJTCS), have been fabricated using thin-film and micro-electro-mechanical systems (MEMS) technology. Improved sensitivity and accuracy over single-junction thermoelements and targeted performance will allow new measurement approaches in traditionally troublesome areas such as the low frequency and high current regimes. A review is presented of new microfabrication techniques and packaging methods that have resulted from a collaborative effort at Sandia National Laboratories and the National Institute of Standards and Technology (MHZ).

A novel multi-chip module (MCM) design and manufacturing methodology which utilizes active CMOS circuits in what is normally a passive substrate realizes the `smart substrate` for use in highly testable, high reliability MCMS. The active devices are used to test the bare substrate, diagnose assembly errors or integrated circuit (IC) failures that require rework, and improve the testability of the final MCM assembly. A static random access memory (SRAM) MCM has been designed and fabricated in Sandia Microelectronics Development Laboratory in order to demonstrate the technical feasibility of this concept and to examine design and manufacturing issues which will ultimately determine the economic viability of this approach. The smart substrate memory MCM represents a first in MCM packaging. At the time the first modules were fabricated, no other company or MCM vendor had incorporated active devices in the substrate to improve manufacturability and testability, and thereby improve MCM reliability and reduce cost.