Tin whisker growth mechanism study using a new acceleration method
Abstract not provided.
Publications
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Jump to search filtersA Mechanism for Hillock Formation over Electrodeposited Thin Tin Films
Abstract not provided.
TCG XIV Material Aging Five Year Plan FY09-13
Abstract not provided.
Tin Whisker Mitigation Methods
Abstract not provided.
Effects of Storage Environments On The Solderability of Nickel-Palladium-Gold Finish With Pb-based And Pb-free Solders
Abstract not provided.
Solderability Testing of Pb-free Solder Alloys Versus 63Sn-37Pb Eutectic Solder For High Reliability Applications
Abstract not provided.
The Effect of Partial Solder Filling on Thermal-Mechanical Fatigue of Cu-Plated Through Holes
International Journal of Materials and Structural Integrity
Abstract not provided.
Effects of Storage Environments On The Solderability of Nickel-Palladium-Gold Finish with Pb-based And Pb-free Solders
Abstract not provided.
The Sn Whisker Issue in High-Reliability Electronics
Abstract not provided.
Military Use of Commercial Electronics (COTS) COTS AGING
Abstract not provided.
Environmental mandates and soldering technology: The path forward
Welding Journal (Miami, Fla)
Environmental legislation related to lead-free soldering technology that have been imposed in several nations are requiring manufacturers to consider several technical and business issues to effectively use the lead-free soldering technology. Several researches for reflow/furnace soldering have focused on tin-silver-copper compositions, commonly referred to as the SAC alloys. These alloys exhibit similar processing performance but presents both solderability and temperature sensitivity issues. The SAC396 alloy has been recommended as a standard replacement for tin/lead solders by the International Electronics Manufacturing Initiative. Long-term reliability is also a primary concern associated with the adaptation of lead-free solder alloys for critical applications. The international soldering community is continuously working to meet the technical challenges of implementing a lead-free soldering technology into consumer and high-reliability electronics.
Collaborative Mechanisms Between Sandia and other LM Operating Companies
Abstract not provided.
A General Methodology to Predict Fatigue Life in Lead-Free Solder Alloy Interconnects
Journal of Electronic Packaging
Abstract not provided.
Development of the Damage State Variable for a Unified Creep Plasticity Damage Constitutive Model of the 95.5Sn-3.9Ag-0.6Cu Lead-Free Solder
IEEE Journal of Electronic Packaging
Abstract not provided.
Validation of a general fatigue life prediction methodology for Sn-Ag-Cu lead-free solder alloy interconnects
Proposed for publication in the IEEE Journal of Electronic Packaging.
Abstract not provided.
Soldering Technology for High and Ultra High Temperature Service
Abstract not provided.
Joint DoD/DOE Munitions Program (JMP) Five Year Plan FY08-12 Military Use of COTS
Abstract not provided.
Solid-State Interface Reactions Between Silver and 95.5Sn-3.9Ag-0.6Cu and 63Sn-37Pb Solders
Metallurgical and Materials Transactions A
Abstract not provided.
Solder Interconnect Predictor (SIP) Software Package
Abstract not provided.
Fatigue Life Prediction Methodology for Lead-Free Solder Alloy Interconnects: Development and Validation
Abstract not provided.
Comparison of the Solderability Performances of Inhibitor Containing and Inhibitor-Free Immersion Silver Coatings
Abstract not provided.
Tin Whisker Mitigation Methods
Abstract not provided.
The effects of long-term storage on the solderability of immersion silver coatings
Proceedings of the 3rd International Brazing and Soldering Conference
The solderability of an immersion Ag finish was evaluated after the exposure of test specimens to a Battelle Class II environment, which accelerates the storage conditions of light industrial surroundings. The solderability metric was the contact angle, (θC), as determined by the meniscometer/wetting balance technique. Auger surface and depth profile analyses were utilized to identify changes in the coating chemistry. The solderability test results indicate that there was no appreciable loss in solderability when the immersion Ag coated coupons were packaged in vapor phase corrosion (VPC) inhibitor bags and/or inhibitor bags with VPC inhibitor paper and aged for 8 hours, 1 week or 2 weeks in the Battelle Class II environment. An increase in surface carbon concentration after aging did not appear to significantly affect solderability. Copyright © 2006 ASM International®.
Comparison Of The Solderability Performances Of Inhibitor Containing And Inhibitor-Free Immersion Silver Coatings
Abstract not provided.
Lead-Free Surface Finishes: Compatibility with Assembly Processes and Interconnection Reliability
Abstract not provided.
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