We present a new collection of data on the load-stress relaxation-unload behavior of MinK and FiberFrax Board (FF) insulation materials used as pellets in-line with thermal battery electrochemical stacks. Both materials were subjected to standard thermal preparations, and then tested at room temperature. Intermediate term stress relaxation tests are presented (order 104 minutes of relaxation) showing that FF relaxation is not significantly stress or deformation dependent, but MinK is moderately so. Moreover, stress-strain curves associated with specimen unloading, reloading, and unloading again are presented for both materials. FF and MinK are substantially different here. Acute material variability is observed though test conditions and material preparations are standardized. A modeling approach is presented to empirically estimate the amount of stress relaxation at room temperature, and from this state, represent the unloading stress-strain behavior of both materials. This effort provides a complete framework for representing (in an engineering sense) both materials in thermal battery performance simulations.
A parallel, adaptive overlay grid procedure is proposed for use in generating all-hex meshes for stochastic (SVE) and representative (RVE) volume elements in computational materials modeling. The mesh generation process is outlined including several new advancements such as data filtering to improve mesh quality from voxelated and 3D image sources, improvements to the primal contouring method for constructing material interfaces and pillowing to improve mesh quality at boundaries. We show specific examples in crystal plasticity and syntactic foam modeling that have benefitted from the proposed mesh generation procedure and illustrate results of the procedure with several practical mesh examples.
A viscoelastic constitutive analysis is used to investigate the counter-intuitive observation of “mobility decrease with increased deformation through yield” in a glass forming polymer under compressive and tensile loading conditions. Current Sandia National Laboratory polymer models are built on the assumption that deformation enhances the mobility of the material. If this assumption is not true at small strain rates (e.g., thermal fluctuations in stockpile storage) then models will not be able to accurately predict stress evolution and potential failure of components during stockpile storage. The behavior of an epoxy thermoset is explored using an extensively validated material “clock” model, the Simplified Potential Energy Clock (SPEC) model. This methodology allows for a comparison between the linear viscoelastic (LVE) limit and the true non-linear viscoelastic (NLVE) representation and enables exploration of a wide range of conditions that are not practical to explore experimentally. The model predicts the behavior described as “mobility decrease with increased deformation” in the LVE limit and at low strain rates for NLVE. Only when loading rates are sufficient to decrease the material shift factor by multiple orders of magnitude is the anticipated deformation induced mobility or “mobility increase with increased deformation” observed. While the model has not been “trained” for these behaviors, it also predicts that the normalized stress relaxation response is indistinguishable amongst strain levels in the “post-yield” region as has been experimentally reported. At long time, which has not been examined experimentally, the model predicts the normalized relaxation curves “crossover” and return to the LVE ordering. These findings further demonstrate the ability of rheologically simple models to represent experimentally measured material response and present predictions at long time scales that could be tested experimentally.
