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Morphology and growth kinetics of straight and kinked Tin whiskers

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Michael, Joseph R.; Grant, Richard P.; McKenzie, Bonnie B.; Yelton, William G.

Time-lapse SEM studies of Sn whiskers were conducted to estimate growth kinetics and document whisker morphologies. For straight whiskers, growth rates of 3 to 4 microns per day were measured at room temperature. Two types of kinked whiskers were observed. For Type A kinks, the original growth segment spatial orientation remains unchanged, there are no other changes in morphology or diameter, and growth continues. For Type B kinks, the spatial orientation of the original segment changes and it appears that the whisker bends over. Whiskers with Type B kinks show changes in morphology and diameter at the base, indicating grain boundary motion in the film, which eliminates the conditions suitable for long-term whisker growth. To estimate the errors in the whisker growth measurements, a technique is presented to correct for SEM projection effects. With this technique, the actual growth angles and lengths of a large number of whiskers were collected. It was found that most whiskers grow at moderate or shallow angles with respect to the surface; few straight whiskers grow nearly normal to the surface. In addition, there is no simple correlation between growth angles and lengths for whiskers observed over an approximate 2-year period. © 2012 The Minerals, Metals & Materials Society and ASM International (outside the USA).

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TYPE Journal Article YEAR 2013
OSTIScopus

The hardness and strength of metal tribofilms: An apparent contradiction between nanoindentation and pillar compression

Acta Materialia

Battaile, Corbett C.; Boyce, Brad L.; Weinberger, Christopher R.; Prasad, Somuri V.; Michael, Joseph R.; Clark, Blythe C.

After sliding contact of a hard spherical counterface on a metal surface, the resulting wear scar possesses a complex microstructure consisting of dislocations, dislocation cells, ultrafine or nanocrystalline grains, and material that has undergone dynamic recovery. There remains a controversy as to the mechanical properties of the tribolayer formed in this wear scar. To investigate the properties of this thin layer of damaged material in single crystal nickel, we employed two complementary techniques: pillar compression and nanoindentation. In both techniques, the tests were tailored to characterize the near surface properties associated with the top 500 nm of material, where the wear-induced damage was most extensive. Pillar compression indicated that the worn material was substantially softer than neighboring unworn base metal. However, nanoindentation showed that the wear track was substantially harder than the base metal. These apparently contradictory results are explained on the basis of source limited deformation. The worn pillars are softer than unworn pillars due to a pre-straining effect: undefected pillars are nearly free of dislocations, whereas worn pillars have pre-existing dislocations built in. Nanoindentation in worn material behaves harder than unworn single crystal nickel due to source length reduction from the fine-grained wear structure. © 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

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TYPE Conference YEAR 2012
ScopusOSTI
Results 126–150 of 261
Results 126–150 of 261