Publications

Abstract not provided.

Encapsulation is a common process used in manufacturing most non-nuclear components including: firing sets, neutron generators, trajectory sensing signal generators (TSSGs), arming, fusing and firing devices (AF and Fs), radars, programmers, connectors, and batteries. Encapsulation is used to contain high voltage, to mitigate stress and vibration and to protect against moisture. The purpose of the ASCI Encapsulation project is to develop a simulation capability that will allow us to aid in the encapsulation design process, especially for neutron generators. The introduction of an encapsulant poses many problems because of the need to balance ease of processing and properties necessary to achieve the design benefits such as tailored encapsulant properties, optimized cure schedule and reduced failure rates. Encapsulants can fail through fracture or delamination as a result of cure shrinkage, thermally induced residual stresses, voids or incomplete component embedding and particle gradients. Manufacturing design requirements include (1) maintaining uniform composition of particles in order to maintain the desired thermal coefficient of expansion (CTE) and density, (2) mitigating void formation during mold fill, (3) mitigating cure and thermally induced stresses during cure and cool down, and (4) eliminating delamination and fracture due to cure shrinkage/thermal strains. The first two require modeling of the fluid phase, and it is proposed to use the finite element code GOMA to accomplish this. The latter two require modeling of the solid state; however, ideally the effects of particle distribution would be included in the calculations, and thus initial conditions would be set from GOMA predictions. These models, once they are verified and validated, will be transitioned into the SIERRA framework and the ARIA code. This will facilitate exchange of data with the solid mechanics calculations in SIERRA/ADAGIO.

Polymer stresses around sharp corners and in constrained geometries of encapsulated components can generate cracks leading to system failures. Often, analysts use maximum stresses as a qualitative indicator for evaluating the strength of encapsulated component designs. Although this approach has been useful for making relative comparisons screening prospective design changes, it has not been tied quantitatively to failure. Accurate failure models are needed for analyses to predict whether encapsulated components meet life cycle requirements. With Sandia's recently developed nonlinear viscoelastic polymer models, it has been possible to examine more accurately the local stress-strain distributions in zones of likely failure initiation looking for physically based failure mechanisms and continuum metrics that correlate with the cohesive failure event. This study has identified significant differences between rubbery and glassy failure mechanisms that suggest reasonable alternatives for cohesive failure criteria and metrics. Rubbery failure seems best characterized by the mechanisms of finite extensibility and appears to correlate with maximum strain predictions. Glassy failure, however, seems driven by cavitation and correlates with the maximum hydrostatic tension. Using these metrics, two three-point bending geometries were tested and analyzed under variable loading rates, different temperatures and comparable mesh resolution (i.e., accuracy) to make quantitative failure predictions. The resulting predictions and observations agreed well suggesting the need for additional research. In a separate, additional study, the asymptotically singular stress state found at the tip of a rigid, square inclusion embedded within a thin, linear elastic disk was determined for uniform cooling. The singular stress field is characterized by a single stress intensity factor K{sub a} and the applicable K{sub a} calibration relationship has been determined for both fully bonded and unbended inclusions. A lack of interfacial bonding has a profound effect on inclusion-tip stress fields. A large radial compressive stress is generated in front of the inclusion-tip when the inclusion is well bonded, whereas a large tensile hoop stress is generated when the inclusion is unbended, and frictionless sliding is allowed. Consequently, an epoxy disk containing an unbended inclusion appears more likely to crack when cooled than a disk containing a fully bonded inclusion. A limited number of tests have been carried out to determine if encapsulant cracking can be induced by cooling a specimen fabricated by molding a square, steel insert within a thin, epoxy disk. Test results are in qualitative agreement with analysis. Cracks developed only in disks with mold-released inserts, and the tendency for cracking increased with inclusion size.

Abstract not provided.

The effects of chemical aging on the behavior of carbon black filled rubber were investigated by two types of tests, aging under no strain and aging under a constant strain. A slight modification of the damage-based theory of Segalman, used previously on unaged samples, was found to be consistent with the experimental data.

The temperature, curing, and filler dependencies of the viscosities of common epoxies used at Sandia encapsulants are presented along with examples of useful applications.

Butyl rubber, unfortunately, has pronounced nonlinear viscoelastic behavior, which may be modelled by a separable KBKZ formalism. While these effects seem to have minimal impact on accelerated sealing force measurements, they do severely impact compression set tests. Therefore, a new test is suggested for evaluating field-return o-rings which is free from such confounding effects.

Two thin-walled Al tubes were filled with epoxy which were cured isothermally; one tube was instrumented with strain gauges, and the other with thermocouples. Finite element codes were used. Predicted and measured centerline hoop strains are shown; predictions and measurements agree. This is being applied to encapsulated components.

Sandia now has the capability to evaluate stresses during cure of epoxies with finite element codes. Numerous material parameters are needed as input to these codes. I present a relatively quick set of tests which enable evaluation of the required thermophysical properties. Ease and accuracy of the tests improve as the reaction rate of the thermoset slows. Material parameters for common encapsulants at Sandia are presented in tables.

No abstract available.

The disappearance of isocyanate groups in 20 lb/ft{sup 3} rigid polyurethane encapsulating foam (44402-20) was monitored by FTIR spectroscopy leading to an activation energy of 4 kcal/mole. The disappearance of isocyanates can be due to either crosslinking reactions or gas production. Attempting to separate these two reaction paths, we measured the gel time and volume change during cure leading to activation energies of 5 and 6 kcal/mole for the crosslinking and foaming mechanisms respectively. 3 refs., 16 figs.

As a crosslinking polymer cures, dramatic changes in molecular architecture occur. These structural changes in turn affect the viscoelastic behavior of the material. At a critical extent of reaction (the gel point), the polymer undergoes a transition from a viscous liquid to an elastic solid. We have monitored the evolution of structure and viscoelasticity in the most common epoxy encapsulant used at Sandia, diethanolamine-cured Epon 828. The structure evolves according to percolation theory, and the viscoelasticity evolves according to our dynamic scaling theory for branched polymers. 9 refs., 12 figs.