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The electromechanical behavior of piezoelectric thin film composite diaphragms possessing in-plane stresses

Journal of Micromechanics and Microengineering

Griffin, Benjamin G.; Williams, Matthew D.; Wang, G.; Sankar, B.V.; Cattafesta, L.N.; Sheplak, M.

Many piezoelectric microelectromechanical systems (MEMS) measure or generate acoustic signals via the motion of radially non-uniform, thin film composite plates. The composite layers provide piezoelectric actuation, structural support, electrode metallization, passivation, etc. Often, the layers are non-uniform over the plate and contain residual stresses introduced during the fabrication process. Accurate models of non-uniform composite plate mechanics are crucial for predicting and optimizing device performance. In this paper, an analytical solution for a radially non-uniform, piezoelectric, circular composite plate incorporating residual stress is derived. The analytical solution is compared to experimental measurements of a MEMS piezoelectric diaphragm. The results show the improved accuracy of the analytical model when including film stress, the speed of the analytical solution as compared to finite element analysis, the sensitivity of device performance to residual stress and the importance of accurate film stresses as model inputs. The analytical model presented is useful as a design optimization tool given the efficiency of the computational time, shown to be 275 times less than a comparable finite element analysis.

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Parameterized Receptacle-Pin Contact Model

Williams, Matthew D.

This report describes a simple, quasi-static, closed-form, parameterized model that predicts the contact forces acting between axially-engaging electrical contact receptacles and a pin. This approach is useful for design studies and reduced-order mechanism modeling, where receptacle-pin insertion forces have traditionally been difficult to quantify without high-fidelity (e.g. rigid body dynamics, finite element analysis) simulations. A Matlab implementation of the model is provided and is demonstrated for three receptacle geometries. Results are compared to rigid body dynamics simulations for the first two geometries and experimental insertion force measurements for the third.

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5 Results
5 Results