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Laser drilling of printed wiring boards: Final report on work sponsored by Sandia LDRD program

Arzigian, James S.

Traditionally, electrical connections- between layers of a printed wiring board are formed by mechanically drilling holes through all layers and then plating the resulting structure to provide electrical connections between the layers. The mechanical drilling process is very capital- and labor-intensive and is often a bottleneck in board production. The goal of this program was the development of laser drilling as an alternative to mechanical drilling. Cost advantages and the ability to produce smaller holes were both of interest. Although it had initially been intended to develop all processes at Sandia, suitable emerging processes and materials were identified in industry during the course of the work. Because of these industry efforts, it was decided to terminate the LDRD efforts after the first year of work and to pursue collaborative development efforts with industrial partners. A laser drilling facility is currently being developed at Sandia to pursue this work further.

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Cleaning of printed circuit assemblies with surface-mounted components

Arzigian, James S.

The need for ever-increasing miniaturization of airborne instrumentation through the use of surface mounted components closely placed on printed circuit boards highlights problems with traditional board cleaning methods. The reliability of assemblies which have been cleaned with vapor degreasing and spray cleaning can be seriously compromised by residual contaminants leading to solder joint failure, board corrosion, and even electrical failure of the mounted parts. In addition, recent government actions to eliminate fully halogenated chlorofluorocarbons (CFC) and chlorinated hydrocarbons from the industrial environment require the development of new cleaning materials and techniques. This paper will discuss alternative cleaning materials and techniques and results that can be expected with them. Particular emphasis will be placed on problems related to surface-mounted parts. These new techniques may lead to improved circuit reliability and, at the same time, be less expensive and less environmentally hazardous than the traditional systems. 5 refs.

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3 Results
3 Results