Publications Details

Model Validation of a Modular Foam Encapsulated Electronics Assembly with Controlled Preloads via Additively Manufactured Silicone Lattices

Ballance, Tanner; Lindsey, Bryce; Saraphis, Daniel; Khan, Moheimin Y.; Long, Kevin N.; Kramer, Sharlotte L.; Roberts, Christine C.

Traditional electronics assemblies are typically packaged using physically or chemically blown potted foams to reduce the effects of shock and vibration. These potting materials have several drawbacks including manufacturing reliability, lack of internal preload control, and poor serviceability. A modular foam encapsulation approach combined with additively manufactured (AM) silicone lattice compression structures can address these issues for packaged electronics. These preloaded silicone lattice structures, known as foam replacement structures (FRSs), are an integral part of the encapsulation approach and must be properly characterized to model the assembly stresses and dynamics. In this study, dynamic test data is used to validate finite element models of an electronics assembly with modular encapsulation and a direct ink write (DIW) AM silicone FRS. A variety of DIW compression architectures are characterized, and their nominal stress-strain behavior is represented with hyperfoam constitutive model parameterizations. Modeling is conducted with Sierra finite element software, specifically with a handoff from assembly preloading and uniaxial compression in Sierra/Solid Mechanics to linear modal and vibration analysis in Sierra/Structural Dynamics. This work demonstrates the application of this advanced modeling workflow, and results show good agreement with test data for both static and dynamic quantities of interest, including preload, modal, and vibration response.