Publications Details
Hydrogen incorporation into III-V nitrides during processing
Hydrogen is readily incorporated into GaN and related alloys during wet and dry etching, chemical vapor deposition of dielectric overlayers, boiling in water and other process steps, in addition to its effects during MOCVD or MOMBE growth. The hydrogen is bound at defects or impurities and passivates their electrical activity. Reactivation occurs at 450-550{degrees}C, but evolution from the crystal requires much higher temperatures ({ge} 800{degrees}C).