Publications Details
Experiment-Based Computational Investigation of Thermomechanical Stresses in Flip Chip BGA Using the ATC4.2 Test Vehicle
Stress measurement test chips were flip chip assembled to organic BGA substrates containing micro-vias and epoxy build-up interconnect layers. Mechanical degradation observed during temperature cycling was correlated to a damage theory developed based on 3D finite element method analysis. Degradation included die cracking, edge delamination and radial fillet cracking.