Publications Details
Analysis and measurement of thermal resistance in a 3-dimensional silicon multichip module populated with assembly test chips
Three dimensional multichip modules (MCMS) present an unusual challenge to the thermal designer. For example, high thermal resistance between upper planes of the MCM and the thermally anchored bottom plane can lead to the development of excessive temperatures. As new designs emerge, it becomes desirable to have methods of experimentally determining interior temperatures in the module in order to validate complex finite element calculations. In order to develop methods for assessing the thermal performance of a 3D MCM, we have developed a test module with three planes or slices. In this paper, we report on some initial calculations and measurements for the 3D MCM. In addition, we discuss the improvement in thermal performance obtained by replacing the top slice with a diamond substrate. Finite element method (FEM) thermal calculations have been done with both the workstation based analyzer P/Thermal from PDA Engineering and the PC program, Inertia from Modern Computer Aided Engineering. These analyses have assumed no heat losses by radiation or convection.