Publications Details
A Signature Analysis Method for IC Failure Analysis
A new method of signature analysis is presented and explained. This method of signature analysis can be based on either experiential knowledge of failure analysis, observed data, or a combination of both. The method can also be used on low numbers of failures or even single failures. It uses the Dempster-Shafer theory to calculate failure mechanism confidence. The model is developed in the paper and an example is given for its use.