Publications

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Deep reactive ion etching (DRIE) of silicon enables high aspect ratio, deep silicon features that can be incorporated into the fabrication of microelectromechanical systems (MEMS) sensors and actuators. The DRIE process creates silicon structures and consists of three steps: conformal polymer deposition, ion sputtering, and chemical etching. The sequential three step process results in sidewalls with roughness that varies with processing conditions. This paper reports the sidewall roughness for DRIE etched MEMS as a function of trench width from 5 μm to 500 μm for a 125 μm thick device layer corresponding to aspect ratios from 25 to 0.25. Using a scanning electron microscope (SEM), the surfaces were imaged detecting an upper region exhibiting a scalloping morphology and a rougher lower region exhibiting a curtaining morphology. The height of rougher curtaining region increases linearly with aspect ratio when the etch cleared the entire device layer. The surface roughness for two trench widths: 15 μm and 100 μm were further characterized using an atomic force microscope (AFM), and RMS roughness values are reported as a function of height along the surface. The sidewall roughness varies with height and depends on the trench width. Copyright © 2011 by ASME.

Mudstone mechanical testing is often limited by poor core recovery and sample size, preservation and preparation issues, which can lead to sampling bias, damage, and time-dependent effects. A micropillar compression technique, originally developed by Uchic et al. 2004, here is applied to elasto-plastic deformation of small volumes of mudstone, in the range of cubic microns. This study examines behavior of the Gothic shale, the basal unit of the Ismay zone of the Pennsylvanian Paradox Formation and potential shale gas play in southeastern Utah, USA. Precision manufacture of micropillars 5 microns in diameter and 10 microns in length are prepared using an ion-milling method. Characterization of samples is carried out using: dual focused ion - scanning electron beam imaging of nano-scaled pores and distribution of matrix clay and quartz, as well as pore-filling organics; laser scanning confocal (LSCM) 3D imaging of natural fractures; and gas permeability, among other techniques. Compression testing of micropillars under load control is performed using two different nanoindenter techniques. Deformation of 0.5 cm in diameter by 1 cm in length cores is carried out and visualized by a microscope loading stage and laser scanning confocal microscopy. Axisymmetric multistage compression testing and multi-stress path testing is carried out using 2.54 cm plugs. Discussion of results addresses size of representative elementary volumes applicable to continuum-scale mudstone deformation, anisotropy, and size-scale plasticity effects. Other issues include fabrication-induced damage, alignment, and influence of substrate.

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Shock testing was performed on a selected commercial-off-the-shelf - MicroElectroMechanical System (COTS-MEMS) accelerometer to determine the margin between the published absolute maximum rating for shock and the 'measured' level where failures are observed. The purpose of this testing is to provide baseline data for isolating failure mechanisms under shock and environmental loading in a representative device used or under consideration for use within systems and assemblies of the DOD/DOE weapons complex. The specific device chosen for this study was the AD22280 model of the ADXL78 MEMS Accelerometer manufactured by Analog Devices Inc. This study focuses only on the shock loading response of the device and provides the necessary data for adding influence of environmental exposure to the reliability of this class of devices. The published absolute maximum rating for acceleration in any axis was 4000 G for this device powered or unpowered. Results from this study showed first failures at 8000 G indicating a margin of error of two. Higher shock level testing indicated that an in-plane, but off-axis acceleration was more damaging than one in the sense direction.

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Shape memory alloys (SMAs) are metals that exhibit large recoverable strains and exert large forces with tremendous energy densities. The behavior of SMAs is thermomechanically coupled. Their response to temperature is sensitive to their loading condition and their response to loading is sensitive to their thermal condition. This coupled behavior is not to be circumvented, but to be confronted and understood, since it is what manifests SMA's superior clamping performance. To reasonably characterize the coupled behavior of SMA clamping rings used in safety mechanisms, we conduct a series of experiments on SMA samples. The results of the tests will allow increased fidelity in modeling and failure analysis of parts.

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Instrumented indentation has yielded mixed results when used to measure surface residual stresses in metal films. Relative to metals, many glasses and ceramics have a low modulus-to-yield strength (E/σ y) ratio. The advantage of this characteristic for measuring residual stress using instrumented indentation is demonstrated by a series of comparative spherical and conical tip finite element simulations. Two cases are considered: (i) a material with E/σ y= 24 - similar to glass and (ii) a material with E /σy = 120 - similar to metal films. In both cases, compressive residual stress shifts the simulated load-displacement response toward increasing hardness, irrespective of tip geometry. This shift is shown to be entirely due to pile up for the "metal" case, but primarily due to the direct influence of the residual stress for the "glass" case. Hardness changes and load-displacement curve shifts are explained by using the spherical cavity model. Supporting experimental results on stressed glasses are provided.

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