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The morphology of tensile failure in tantalum

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Clark, Blythe C.; Lu, Ping; Carroll, J.D.; Weinberger, C.R.

The deformation, crack nucleation, coalescence, and rupture process of pure tantalum (99.9 pct) were studied under room temperature quasistatic loading using several in situ and ex-situ techniques including optical metallography, scanning electron microscopy (SEM), electron backscatter diffraction (EBSD), and transmission-electron microscopy (TEM). The fracture surface of tantalum forms a ridge-and-valley morphology that is distinct from conventional notions of ductile dimple microvoid coalescence, and also distinct from spall damage formed during dynamic shock conditions. Failure proceeds by void nucleation at a dislocation cell wall or in subgrain interiors. Coalescence appears to involve a two-stage damage progression: first individual voids coalesce along the tensile axis forming diamond-shaped multivoid cavities; then cavities link-up by intercavity necking. Final rupture occurs when the intercavity necks thin to ~100-nm films and fail by crystallographic cleavage. This final tearing process was observed using in situ TEM tensile deformation of a thin tantalum film. The detailed microstructural and morphological observations of the current study can be used to guide the development of improved models for tearing of ductile metals. © 2013 The Author(s).

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An experimental statistical analysis of stress projection factors in BCC tantalum

Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing

Carroll, J.D.; Clark, Blythe C.; Buchheit, Thomas E.; Boyce, Brad L.; Weinberger, C.R.

Crystallographic slip planes in body centered cubic (BCC) metals are not fully understood. In polycrystals, there are additional confounding effects from grain interactions. This paper describes an experimental investigation into the effects of grain orientation and neighbors on elastic–plastic strain accumulation. In situ strain fields were obtained by performing digital image correlation (DIC) on images from a scanning electron microscope (SEM) and from optical microscopy. These strain fields were statistically compared to the grain structure measured by electron backscatter diffraction (EBSD). Spearman rank correlations were performed between effective strain and six microstructural factors including four Schmid factors associated with the <111> slip direction, grain size, and Taylor factor. Modest correlations (~10%) were found for a polycrystal tension specimen. The influence of grain neighbors was first investigated by re-correlating the polycrystal data using clusters of similarly-oriented grains identified by low grain boundary misorientation angles. Second, the experiment was repeated on a tantalum oligocrystal, with through-thickness grains. Much larger correlation coefficients were found in this multicrystal due to the dearth of grain neighbors and subsurface microstructure. Finally, a slip trace analysis indicated (in agreement with statistical correlations) that macroscopic slip often occurs on {110}<111> slip systems and sometimes by pencil glide on maximum resolved shear stress planes (MRSSP). These results suggest that Schmid factors are suitable for room temperature, quasistatic, tensile deformation in tantalum as long as grain neighbor effects are accounted for.

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Results 201–223 of 223
Results 201–223 of 223