Publications

ULSI manufacturing technologies have resulted in the development of Ultra-Pure Processing (UPP) capabilities for the world-wide semiconductor industry. The primary goal of Ultra Pure Processing is the elimination of extraneous contaminants, both gaseous and particulate, from the wafer process environment. This calls for a comprehensive approach to the design, operation, and maintenance of semiconductor process equipment. Through UPP one may reduce the number of uncontrolled variables within a system enhancing implementation of Statistical Process Control on the process environment within the tool (in situ). Greater control over the process environment translates into increased product quality, manufacturability, throughput and yield. Instituting UPP requires the capability of monitoring contaminants in the process environment a well as a systematic approach to isolating and eliminating contamination sources. Ultra Pure Processing can result from a Contamination Reduction Program. Presented here are the results from a Contamination Reduction Program performed on a state-of-the-art vertical thermal process reactor (VTR). 8 figs., 5 tabs.