Solder Joint Reliability Predictions for Leadless Chip Resistors, Chip Capacitors, and Ferrite Chip Inductors Using the SRS Software
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Jump to search filtersConstitutive Model Development for Predicting Thermal Mechanical Fatigue Deformation in Solder Interconnects
Abstract not provided.
Computational continuum modeling of solder interconnects
TMS Annual Meeting
The most commonly used solder for electrical interconnections in electronic packages is the near eutectic 60Sn-40Pb alloy. This alloy has a number of processing advantages (suitable melting point of 183C and good wetting behavior). However, under conditions of cyclic strain and temperature (thermomechanical fatigue), the microstructure of this alloy undergoes a heterogeneous coarsening and failure process that makes the prediction of solder joint lifetime complex. A viscoplastic, microstructure dependent, constitutive model for solder, which is currently under development, was implemented into a finite element code. With this computational capability, the thermomechanical response of solder interconnects, including microstructural evolution, can be predicted. This capability was applied to predict the thermomechanical response of various leadless chip carrier solder interconnects to determine the effects of variations in geometry and loading. In this paper, the constitutive model will first be briefly discussed. The results of computational studies to determine the effect of geometry and loading variations on leadless chip carrier solder interconnects then will be presented.
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