Publications

In the manufacture of printed wiring boards (PWB), plasma etchback and desmear processes facilitate the making of good mechanical and electrical bonds of copper inner layers to copper plating. Without sufficient plasma treatment, internal layer copper features receive inadequate polymer removal which results in circuit discontinuity during the plating process. Additionally, the plasma serves to roughen the polymer wall of drilled holes which improves copper adhesion. To ensure proper plasma treatment, careful adherence to strict production guidelines is essential. These guidelines include attention to several critical criteria in placement, pretreatment and treatment of the PWBs during the plasma process; process verification via post plasma testing; and careful process monitoring throughout. In this brief, some guidelines for process monitoring and control will be discussed. A description of a new plasma monitor utilizing optical emission spectroscopy (OES), developed cooperatively between Sandia National Laboratories, National Consortium for Manufacturing Sciences (NCMS) and Texas Instruments Inc., will be discussed along with possible benefits derived from in situ monitoring of plasma systems.

Plasma processes for etching and desmear of electronic components and printed wiring boards (PWB) are difficult to predict and control. Non-uniformity of most plasma processes and sensitivity to environmental changes make it difficult to maintain process stability from day to day. To assure plasma process performance, weight loss coupons or post-plasma destructive testing must be used. The problem with these techniques is that they are not real-time methods and do not allow for immediate diagnosis and process correction. These tests often require scrapping some fraction of a batch to insure the integrity of the rest. Since these tests verify a successful cycle with post-plasma diagnostics, poor test results often determine that a batch is substandard and the resulting parts unusable. These tests are a costly part of the overall fabrication cost. A more efficient method of testing would allow for constant monitoring of plasma conditions and process control. Process anomalies should be detected and corrected before the parts being treated are damaged. Real time monitoring would allow for instantaneous corrections. Multiple site monitoring would allow for process mapping within one system or simultaneous monitoring of multiple systems. Optical emission spectroscopy conducted external to the plasma apparatus would allow for this sort of multifunctional analysis without perturbing the glow discharge. In this paper, optical emission spectroscopy for non-intrusive, in situ process control will be explored along with applications of this technique towards process control, failure analysis and endpoint determination.

Plasma etching and desmear processes for printed wiring board (PWB) manufacture are difficult to predict and control. Non-uniformity of most plasma processes and sensitivity to environmental changes make it difficult to maintain process stability from day to day. To assure plasma process performance, weight loss coupons or post-plasma destructive testing must be used. These techniques are not real-time methods however, and do not allow for immediate diagnosis and process correction. These tests often require scrapping some fraction of a batch to insure the integrity of the rest. Since these tests verify a successful cycle with post-plasma diagnostics, poor test results often determine that a batch is substandard and the resulting parts unusable. These tests are a costly part of the overall fabrication cost. A more efficient method of testing would allow for constant monitoring of plasma conditions and process control. Process anomalies should be detected and corrected before the parts being treated are damaged. Real time monitoring would allow for instantaneous corrections. Multiple site monitoring would allow for process mapping within one system or simultaneous monitoring of multiple systems. Optical emission spectroscopy conducted external to the plasma apparatus would allow for this sort of multifunctional analysis without perturbing the glow discharge. In this paper, optical emission spectroscopy for non-intrusive, in situ process control will be explored along with applications of this technique to for process control, failure analysis and endpoint determination in PWB manufacture.

Although plasma cleaning is a recognized substitute for solvent cleaning in removing organic contaminants, current cleaning rates are impractically low for many applications. A set of experiments is described which demonstrate that the rate of plasma removal of organic contaminants can be greatly increased by modification of the plasma chemistry. A comparison of plasma cleaning rates of argon, oxygen and oxygen/sulfur hexafluoride gases shows that the fluorine containing plasma is at least an order of magnitude faster at etching organics. Rates are reported for the removal of polymer films and of A-9 Aluminum cutting fluid. 7 refs.