Publications

Switch tubes are used in nuclear weapon firing sets and are required to be reliable and impervious to gas permeation for many years. To accomplish this, a gold plated coating of approximately 25 microns is required over all metal surfaces on the tube exterior. The gold has historically been plated using gold cyanide plating chemistry. In this work we proposed to replace the cyanide plating bath with an environmentally friendlier sulfite gold plating bath. Low and high pH sulfite plating chemistries were investigated as possible replacements for the cyanide gold plating chemistry. The low pH plating chemistry demonstrated a gold plated coating which met the high purity, grain size, and hardness requirements for switch tubes. The high pH chemistry was rejected primarily because the hardness of the gold plated coatings was too high and exceeded switch tube coating requirements. A problem with nodule formation on the gold plated surface using the low pH chemistry had to be resolved during this evaluation. The nodule formation was postulated to be produced by generation of SO{sub 2} in the low pH bath causing gold to be precipitated out when the sulfite concentration falls below a minimum level. The problem was resolved by maintaining a higher sulfite concentration and providing an active filtration system during plating. In this initial study, there were no major obstacles found when using a sulfite gold bath for switch tube plating, however, further work is needed on bath control and bath life before adopting it as the primary plating chemistry.

Sandia Laboratories has developed a thin film diamond substrate technology to meet the requirements for high power and high density circuits. Processes were developed to metallize, photopattern, laser process, and, package diamond thin film networks which were later assembled into high power multichip modules (MCMS) to test for effectiveness at removing heat. Diamond clearly demonstrated improvement in heat transfer during 20 Watt, strip heating experiments with junction-to-ambient temperature increases of less than 24 C compared to 126 C and 265 C for the aluminum nitride and ceramic versions, respectively.

As applications for hybrid circuits and multichip modules create demand for higher density circuits and higher power components, new substrate materials are required to deal with the heat generated on the circuit. Sandia National Laboratories is developing diamond substrate technology to meet the requirements of high thermal conductivity. Thin film processes were developed and characterized to delineate conductor-resistor networks on free standing diamond substrates having fine line gold conductors and low and high sheet resistivity resistors. Thin film hybrid circuit technology was developed on CVD-processed, polycrystalline diamond substrates having as-deposited surface finishes as well as those with polished surfaces. Conductors were defined by pattern plating gold and resistors were processed from sputtered tantalum nitride films which were deposited to sheet resistivities of 5 and/or 100 ohms per square. Resistor films on diamond substrates were evaluated for Temperature Coefficient of Resistance (TCR), stability with time and temperature, and trimmability using YAG laser processing. Plated gold conductors were patterned on diamond to feature sizes of 25 microns and successfully tested for adhesion and bondability. Advanced YAG laser trimming techniques were developed to allow resistor trims on both low and high value resistors to within 1% of desip value while maintaining required resistor stability, new trim techniques were needed to offset the carbonization of diamond in the laser trim area. Reliability studies were carried out on the diamond thin film networks which showed them to compare favorably with the same thin film technology on alumina substrates.