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Thermal analysis report of the SANDAC V processor module

Nelson, N.M.

The case and junction temperatures of selected integrated circuits (ICs) on the processor module of the SANDAC V computer were calculated using BETAsoft-R,'' a personal computer, thermal analysis software program. The predicted data was then compared to corresponding IC case temperature measurements from laboratory tests of a functional SANDAC V computer. Although the difference between the actual and calculated values was somewhat higher than expected, the results of the analysis indicate that BETAsoft-R'' identified the critical ICs on the processor module and that it is capable of analyzing printed circuit boards for potential thermal problems before the design layout is finalized. 8 figs., 12 tabs.