Publications Details
Surface Dependent Electron and Negative Ion Density in Inductively Coupled Discharges
Electron and negative ion density have been measured in a modfied Applied Materials DPS metal etch chamber using gas mixtures of BCl{sub 3}, Cl{sub 2} and Ar. Measurements were performed for four dflerent substrate types to examine the influence of surface material on the bulk plasma properties; aluminurq alumina, photoresist and 50 percent patterned aluminum / photoresist. Electron densities in the Cl{sub 2} / BCl{sub 3} mixtures varied from 0.25 to 4 x 10{sup 11} cm{sup -3}. Photodetachment measurements of the negative ion density indicate that the negative ion density was smaller than the electron density and that the electron to negative ion density ratio varied between 1 and 6. The presence of photoresist had a dominant intluence on the electron and negative ion density compared to alumina and aluminum surfaces. In most cases, the electron density above wafers covered with photoresist was a factor of two lower while the negative ion density was a factor of two higher than the aluminum or alumina surfaces.