Publications Details
Some Effects of Specimen and Loading Variables on the Fracture Toughness of Epoxy-to-Substrate Interfaces
The nucleation and growth of cracks at critical interfaces can degrade electrical and mechanical performance of electronic assemblies. Sandia National Laboratories is working to develop a fracture mechanics-based approach for assessing the reliability of components containing interfaces and subjected to thermal/mechanical fatigue. Models are being developed to predict the nucleation of a crack-like flaw in the vicinity of an interface, the path of crack propagation (along interface or into substrate), and the conditions for crack propagation. In addition, interfacial fracture toughness data are being generated to support model development. This paper summarizes an experimental study aimed at measuring the fracture toughness of epoxy-to-substrate interfaces that are representative of those found in bonded and encapsulated electronic components.