Publications Details

Solderability of environmentally exposed Sn-plated surfaces

Hosking, F.M.; Sorensen, N.R.

Solderability of Class II environmentally exposed Ni-Sn plated Cu substrates was evaluated with 60Sn-40Pb solder. Tin thickness were 10, 50, and 150 {mu}in. The 10 {mu}in. plating gave the smallest solder meniscus rise. A general decrease in contact angle, or increase in wettability, was observed with increasing Sn plating. The environmental exposures retarded the wetting rate and increased the time to maximum wetting, particularly with only 10 {mu}in. of Sn. Although the solderability of the 50 and 150 {mu}in. surfaces were not significantly affected by the test conditions, an intermediate plating thickness of 100 {mu}in. is preferred for processing flexibility. 13 refs., 6 figs., 1 tab.