Publications Details

Selective deposition of copper on poly(tetrafluoroethylene)

Rye, R.R.

An additive three step process has been developed for patterned deposition of Cu onto poly(tetrafluoroethylene) (PTFE). The first step involves patterned irradiation with X-rays or electrons which is thought to cross link the PTFE surface; step two involves chemical etching with the result that only the non-irradiated areas are etched; and step three involves selective chemical vapor deposition (CVD) of Cu onto the etched surface at 200 C using (hexafluoroacetylacetonato)Cu(I) trimethylphosphine ((hfac)Cu(PMe{sub 3})). The non-irradiated areas of the surface are covered by a continuous, dense Cu film with X-ray photoelectron spectra show to contain only surface impurities that are easily removed by a short Ar ion sputter. The irradiated areas show the presence of only C and F, characteristic of PTFE.