Publications Details
Plasma cleaning for waste minimization
Although plasma cleaning is a recognized substitute for solvent cleaning in removing organic contaminants, some universal problems in plasma cleaning processes prevent wider use of plasma techniques. Lack of understanding of the fundamental mechanisms of the process, unreliable endpoint detection techniques, and slow process times make plasma cleaning processes less than desirable. Our approach to address these plasma cleaning problems is described. A comparison of plasma cleaning rates of oxygen and oxygen/sulfur hexafluoride gases shows that fluorine-containing plasmas can enhance etch rates by 400% over oxygen alone. A discussion of various endpoint indication techniques is discussed and compared for application suitability. Work toward a plasma cleaning database is discussed. In addition to the global problems of plasma cleaning, an experiment where the specific mixed-waste problem of removal of machine oils from radioactive scrap metal is discussed.