Publications Details
Model-based predictions of solid state intermetallic compound layer growth in hybrid microelectronic circuits
A mathematical model was developed to quantitatively describe the intermetallic compound (IMC) layer growth that takes place between a Sn-based solder and a noble metal thick film conductor material used in hybrid microcircuit (HMC) assemblies. The model combined the reaction kinetics of the solder/substrate interaction, as determined from ancillary isothermal aging experiments, with a 2-D finite element mesh that took account of the porous morphology of the thick film coating. The effect of the porous morphology on the IMC layer growth when compared to the traditional 1-D computations was significant. The previous 1-D calculations under-predicted the nominal IMC layer thickness relative to the 2-D case. The 2-D model showed greater substrate consumption by IMC growth and lesser solder consumption that was determined with the 1-D computation. The new 2-D model allows the design engineer to better predict circuit aging and hence, the reliability of HMC hardware that is placed in the field.