Publications Details

Microporous polyimide films for reduced dielectric applications

Saunders, Randall S.

A technique which involves spincoating in conjunction with a thermodynamic process was used to develop microporous polyimide films with lower dielectric constant and better stress reduction properties. A soluble polyimide solution was spincoated into a silicon wafer, and then immediately submerged into toluene. The factors affecting film morphology, thickness, pore size, and percent porosity were investigated.