Publications Details

Integrated environmentally compatible soldering technologies. Final report

Hosking, F.M.; Frear, D.R.; Iman, R.L.; Keicher, D.M.; Lopez, E.P.; Peebles, H.C.; Sorensen, N.R.; Vianco, P.T.

Chemical fluxes are typically used during conventional electronic soldering to enhance solder wettability. Most fluxes contain very reactive, hazardous constituents that require special storage and handling. Corrosive flux residues that remain on soldered parts can severely degrade product reliability. The residues are removed with chlorofluorocarbon (CFC), hydrochlorofluorocarbon (HCFC), or other hazardous solvents that contribute to ozone depletion, release volatile organic compounds into the atmosphere, or add to the solvent waste stream. Alternative materials and processes that offer the potential for the reduction or elimination of cleaning are being developed to address these environmental issues. Timing of the effort is critical, since the targeted chemicals will soon be heavily taxed or banned. DOE`s Office of Environmental Restoration and Waste Management (DOE/EM) has supported Sandia National Laboratories` Environmentally Conscious Manufacturing Integrated Demonstration (ECMID). Part of the ECM program involves the integration of several environmentally compatible soldering technologies for assembling electronics devices. Fluxless or {open_quotes}low-residue/no clean{close_quotes} soldering technologies (conventional and ablative laser processing, controlled atmospheres, ultrasonic tinning, protective coatings, and environmentally compatible fluxes) have been demonstrated at Sandia (SNL/NM), the University of California at Berkeley, and Allied Signal Aerospace-Kansas City Division (AS-KCD). The university demonstrations were directed under the guidance of Sandia staff. Results of the FY93 Soldering ID are presented in this report.