Publications Details

Hold time, strain rate and environmental effects on near eutectic Sn-Pb under conditions of thermomechanical fatigue

Frear, D.R.

We present results that correlate microstructure and mechanical evolution to variations of deformation rate, hold time and environmental effects on the thermomechanical fatigue (TMF) behavior of 60Sn-40Pb solder. The results are used to define valid conditions for performing accelerated TMF tests. TMF tests at deformation rates of 5.6{times}10{sup {minus}4}s{sup {minus}1}, 2.8{times}10{sup {minus}4}s{sup {minus}1} and 2.1{times}10{sup {minus}4}s{sup {minus}1} were performed. Deformation rates greater than 2.8{times}10{sup {minus}4}s{sup {minus}1} result in fewer cycles to failure. At low deformation rates, the microstructure heterogeneously coarsens at cell boundaries. At higher rates, the deformation mechanism changes, and heterogeneous coarsening occurs at a strain concentration in the joint, independent of the microstructure. TMF tests with hold times of 0, 3 and 6 min. at the temperature extremes were performed. At hold times 3 min. or longer the damage at cell boundaries is annealed, resulting in heterogeneous coarsening. With no hold times the TMF life was greatly enhanced as a result of limited coarsening. The effect of the oxygen environment was explored. The TMF life in the presence of oxygen was found to be extended. Valid acceleration conditions for a TMF test of solder are: a deformation rate of 2.8{times}10{sup {minus}4}s{sup {minus}1} or lower, with hold times of 3 mn. or longer.