Publications Details

Fatigue life prediction of solder joints

Jones, Wendell B.

The current status of lifetime prediction under conditions of thermomechanical creep/fatigue is reviewed. Each method is summarized and the results of the application to solder joints is shown. While each method has been applied with some success, a predictive, phenomenological approach has not been developed and validated. A method which captures the response of a crack to steady-state and cycling environments appears to hold most the most promise to provide a useful design tool.