Publications Details
Fabrication of MEMS Devices by Powder-Filling into DXRL-Formed Molds
We have developed a variety of processes for fabricating components for micro devices based on deep x-ray lithography (DXRL). Although the techniques are applicable to many materials, we have demonstrated them using hard (Nd{sub 2}Fe{sub 14}B) and soft (Ni-Zn ferrite) magnetic materials because of the importance of these materials in magnetic micro-actuators and other devices and because of the difficulty fabricating them by other means. The simplest technique involves pressing a mixture of magnetic powder and a binder into a DXRL-formed mold. In the second technique, powder is pressed into the mold and then sintered to densify. The other two processes involve pressing at high temperature either powder or a dense bulk material into a ceramic mold that was previously made using a DXRL mold. These techniques allow arbitrary 2-dimensional shapes to be made 10 to 1000 micrometers thick with in-plane dimensions as small as 50 micrometers and dimensional tolerances in the micron range. Bonded isotropic Nd{sub 2}Fe{sub 14}B micromagnets made by these processes had an energy product of 7 MGOe.