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Diffusion bonding. Temperature and pressure factorial experiment for molybdenum sheet substrates

Brown, L.E.

A temperature between 400 and 500 and a pressure between 40 MPa and 160 MPa were indicated by a two-factor, three-level factorial experiment for diffusion bonding of molybdenum sheet substrates. These substrates were sputter ion plated with palladium (0.5 {mu}m) and silver (10 {mu}m) films on the mating surfaces, with the silver used as a bonding interlayer. The palladium acted as an adhesive layer between the silver film and molybdenum substrate. The silver diffusion bonds that resulted were qualitatively characterized at the interfacial regions, and bonds with no visible interface were obtained at 750OX magnification. Correlations were obtained for voids found optically at the silver/silver bonding interface and colored image maps, illustrating bond quality, produced by nondestructive ultrasonic imaging. Above 160 MPa, the bonding process produces samples with a nonuniform load distribution. These samples contained regions with gaps and well-bonded regions at the silver/silver interface, and all had macroscopic deformation of the silver films.