Publications Details

Computational modeling of direct molten solder delivery for ball grid array applications

Essien, M.

Computational modeling has been performed to determine optimum operational parameters for a piston-driven molten solder jetting device used to create array interconnects for BGA applications. The device is capable of delivering a 20 x 20 array of 600-800 {mu}m diameter molten 60Sn40Pb solder droplets onto an array of copper pads and primarily consists of an electromechanically driven piston, a heated reservoir, and an orifice plate. computer simulations were performed to determine the relationship between the amplitude and the rate of piston displacement, the onset of fluid ``pinch off``, and the production of satellite droplets. Results show that stable droplets are generated when the volume of the displaced fluid has a spherical diameter that is approximately equal to the orifice diameter.