Publications Details
Coarsening of the Sn-Pb solder microstructure in constitutive model-based predictions of solder joint thermal mechanical fatigue
An expression for the coarsening rate of the Pb-rich phase particles was determined through isothermal aging experiments and comparative literature data as: λ = λo+{[4.10×10-5 e-11023/T+15.6×10-8 e-3123/T (dγ/dt)]t}0.256 where γo and γ are the initial and final mean Pb-rich particle diameters, respectively (mm); T is temperature (°K); t is time (s); and dγ/dt is the strain rate (s-1). The phase coarsening behavior showed good agreement with previous literature data from isothermal aging experiments. The power-law exponent, p, for the Pb-rich phase size coarsening kinetics: γp-γop≈t increased from a value of 3.3 at the low aging temperature regime (70-100 °C) to a value of 5.1 at the high temperature regime (135-170 °C), suggesting that the number of short-circuit diffusion paths had increased with further aging. This expression provides an important basis for the microstructurally-based, constitutive equation used in the visco-plastic model for TMF in Sn-Pb solder. The revised visco-plastic model was exercised using a through-hole solder joint configuration. Initial data indicate a satisfactory compatibility between the coarsening expression and the constitutive equations.