Publications Details

Characterization of solder flow on PWB surfaces

Hosking, F.M.; Yost, F.G.

Different solderability tests have been developed to determine the wetting behavior of solder on metallic surfaces. None offer an exact measure of capillary flow associated with conventional mixed technology soldering. With shrinking package designs, increasing reliability requirements, and the emergence of new soldering technologies, there is a growing need to better understand and predict the flow of solder on printed wiring board (PWB) surfaces. Sandia National Laboratories has developed a capillary flow solderability test, through a joint effort with the National Center for Manufacturing Sciences, that considers this fundamental wetting issue for surface mount technology. The test geometry consists of a metal strip (width, {delta}) connected to a circular metal pad (radius, r{sub c}). Test methodology, experimental results, and validation of a flow model are presented in this paper.