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Characterization of dc magnetron sputtering systems for the deposition of tantalum nitride, titanium, and palladium thin films for HMC (hybrid microcircuit) applications

Snow, G.S.

This report covers the initial characterization of two new dc magnetron sputtering systems which were acquired for the purpose of modernizing our capability for the deposition of tantalum nitride, titanium, and palladium thin films for HMC applications. These systems were purchased to replace two old metallization systems which had been used in this application for more than a decade. Parametric studies were carried out to characterize the systems. Operating conditions were established for the deposition of tantalum nitride films in one system and for the deposition of Ti/Pd films in the other system. These conditions were shown to produce films with properties equal to or better than were being achieved with the equipment being replaced. In addition, the new equipment was found to be simpler and easier to operate than the old systems. The data obtained during the course of this characterization study are presented. 15 refs., 44 figs., 8 tabs.