Publications Details
An investigation of using a phase-change material to improve the heat transfer in a small electronic module for an airborne radar application
Finding new and improved means of cooling small electronic packages are of great importance to today's electronic packaging engineer. Thermal absorption through the use of a material which changes phase is an attractive alternative. Taking advantage of the heat capacity of a material's latent heat of fusion is shown to absorb heat away from the electronics, thus decreasing the overall temperature rise of the system. The energy equation is formulated in terms of enthalpy and discretized using a finite-difference method. A FORTRAN program to solve the discretized equations is presented which can be used to analyze heat conduction in a rectangular region undergoing an isothermal phase change. An analysis of heat transfer through a miniature radar electronic module cooled by a phase-change reservoir is presented, illustrating the method's advantages over conventional heat sinks. 41 refs., 11 figs., 2 tabs.