Publications Details

Aging, stressing and solderability of electroplated and electroless copper

Sorensen, N.R.; Hosking, F.M.

Organic inhibitors can be used to prevent corrosion of metals have application in the electronics industry as solderability preservatives. We have developed a model to describe the action of two inhibitors (benzotriazole and imidazole) during the environmental aging and soldering process. The inhibitors bond with the metal surface and form a barrier that prevents or retards oxidation. At soldering temperatures, the metal-organic complex breaks down leaving an oxide-free metal surface that allows excellent wetting by the molten solder. The presence of the inhibitor retards the wetting rate relative to clean copper but provides a vast improvement relative to oxidized copper.