Publications Details

Adhesion of thick film Au to alumina ceramics

Nelson, G.C.

Thick film Au metallizations are commonly used as conductors in hybrid microelectronics that operate at high frequencies. Discrete components are attached to these conductors with 5OPb/5OIn solder. Intermetallic compounds form and grow in the solid state with time; AuIn{sub 2} is the primary compound formed in the Au-5OPb/50In system. A hybrid failed after being artificially aged to consume all of the Au and then subjected to normal thermal cycle and vibration testing. Postmortem analysis revealed that three capacitors had debonded. The failed parts were studied to determine the failure mechanism(s) and define a parametric study to characterize the mechanisms that bond the Au thick film to the ceramic substrate.