Publications Details
A new mini Ball Grid Array (mBGA) multichip module technology
A new die-level packaging technology, mBGA, is reported in this paper. The mBGA enables high circuit packaging density on multichip module (MCM), facilitates die testing to obtain ``known good die,`` and allows a cost effective module assembly. We have designed and fabricated a test vehicle to evaluate mBGA multichip module technology. This paper describes the mBGA technology and the test vehicle multichip module and reports preliminary results on the die test and burn-in, thermal performance and reliability studies.