Publications Details
A method for reducing encapsulation stress to ferrite pot cores
This paper describes a method of reducing the mechanical stress caused when a ferrite pot core is encapsulated in a rigid epoxy. the stresses are due to the differences of coefficient of thermal expansion between the two materials. A stress relief medium, phenolic micro-balloon-filled, syntactic polysulfide, is molded into the shape of the pot core. The molded polysulfide is bonded to the core prior to encapsulation. The new package design has made a significant difference in the ability to survive temperature cycles.