Publications

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There is a rising interest in developing functional electronics using additively manufactured components. Considerations in materials selection and pathways to forming hybrid circuits and devices must demonstrate useful electronic function; must enable integration; and must complement the complex shape, low cost, high volume, and high functionality of structural but generally electronically passive additively manufactured components. This article reviews several emerging technologies being used in industry and research/development to provide integration advantages of fabricating multilayer hybrid circuits or devices. First, we review a maskless, noncontact, direct write (DW) technology that excels in the deposition of metallic colloid inks for electrical interconnects. Second, we review a complementary technology, aerosol deposition (AD), which excels in the deposition of metallic and ceramic powder as consolidated, thick conformal coatings and is additionally patternable through masking. As a result, we show examples of hybrid circuits/devices integrated beyond 2-D planes, using combinations of DW or AD processes and conventional, established processes.

The ability to integrate ceramics with other materials has been limited by the high temperature s (>800C) associated with ceramic processing. A novel process, known as aerosol deposition (AD), capable of preparing ceramic films at room temperature (RT) has been the subject of recent interest in the thermal spray and microelectronics communities. In this process, ceramic particles are accelerated using pressurized gas, impacted on a substrate and form a dense film under vacuum. This revolutionary process eliminates high temperature processing, enabling new coatings and microelectronic device integration as a back end of line process, in which ceramics can be deposited on metals, plastics, and glasses . Future impact s of this technology on Sandia's mission could include improved ceramic integration, miniaturized magnetic circulators in radar applications, new RF communication products, modification of commercial - off - the - shelf electronics, fabrication of conformal capacitors, thin batteries, glass - to - metal seals, and transparent electronics. Currently, optimization for RT solid - state deposition of ceramics is achieved empirically and fundamental mechanisms for ceramic particle - particle bonding are not well understood. Obtaining this knowledge will allow process - microstructure - property relation ship realization and will enable a differentiating ceramic integration capability. This LDRD leveraged Sandias existing equipment and capabilities in simulation, experimentation, and materials characterization to discover the fundamental mechanisms for ceramic particle deformation, particle - substrate bonding, and particle - particle bonding in RT consolidated films. RT deformation of individual Al₂O₃ particles was examined computationally and experimentally as a model system for understanding the complex dynamics associated with in vacuo RT deposition conditions associated with AD. Subsequently, particle - substrate bonding and particle - particle bonding in AD Al₂O₃ consolidated films were examined computationally and experimentally. Fundamental mechanisms behind the AD process were proposed.

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Aerosol deposition (AD) is a solid-state deposition technology that has been developed to fabricate ceramic coatings nominally at room temperature. Sub-micron ceramic particles accelerated by pressurized gas impact, deform, and consolidate on substrates under vacuum. Ceramic particle consolidation in AD coatings is highly dependent on particle deformation and bonding; these behaviors are not well understood. In this work, atomistic simulations and in situ micro-compressions in the scanning electron microscope, and the transmission electron microscope (TEM) were utilized to investigate fundamental mechanisms responsible for plastic deformation/fracture of particles under applied compression. Results showed that highly defective micron-sized alumina particles, initially containing numerous dislocations or a grain boundary, exhibited no observable shape change before fracture/fragmentation. Simulations and experimental results indicated that particles containing a grain boundary only accommodate low strain energy per unit volume before crack nucleation and propagation. In contrast, nearly defect-free, sub-micron, single crystal alumina particles exhibited plastic deformation and fracture without fragmentation. Dislocation nucleation/motion, significant plastic deformation, and shape change were observed. Simulation and TEM in situ micro-compression results indicated that nearly defect-free particles accommodate high strain energy per unit volume associated with dislocation plasticity before fracture. The identified deformation mechanisms provide insight into feedstock design for AD.

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It is well known that nanostructured metals can exhibit significantly improved properties compared to metals with conventional grain size. Unfortunately, nanocrystalline metals typically are not thermodynamically stable and exhibit rapid grain growth at moderate temperatures. This severely limits their processing and use, making them impractical for most engineering applications. Recent work has shown that a number of thermodynamically stable nanocrystalline metal alloys exist. These alloys have been prepared as powders using severe plastic deformation (e.g. ball milling) processes. Consolidation of these powders without compromise of their nanocrystalline microstructure is a critical step to enabling their use as engineering materials. We demonstrate solid-state consolidation of ball milled copper-tantalum nanocrystalline metal powder using cold spray. Unfortunately, the nanocrystalline copper-tantalum powder that was consolidated did not contain the thermodynamically stable copper-tantalum nanostructure. Nevertheless, this does this demonstrates a pathway to preparation of bulk thermodynamically stable nanocrystalline copper-tantalum. Furthermore, it demonstrates a pathway to additive manufacturing (3D printing) of nanocrystalline copper-tantalum. Additive manufacturing of thermodynamically stable nanocrystalline metals is attractive because it enables maximum flexibility and efficiency in the use of these unique materials.

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