Publications Details
Evaluating MetGlasTM Solderability with Tin-Silver-Copper and Tin-Silver-Bismuth Solder Alloys
The solderability of MetGlasTM (subsidiary of Hitachi Metals, America Ltd) 2826 MB, a rapidly solidified metallic foil, was evaluated by the meniscus height/wetting force method for tin-silver-copper (SnAgCu) and tin-silver-bismuth (SnAgBi) solders to understand the effects of the extreme non-equilibrium condition of the MetglasTM surface on solderability performance. Of the variables studied here (solder temperature, heat treatment, and solder composition), solder composition had the largest impact on contact angle. Flux and foil composition remained constant throughout; but, these factors would also be predicted to significantly affect solderability. A greater understanding of the manner whereby non-equilibrium cooling affects solderability of these foils will broaden the application of soldering technology of structures fabricated by rapid cooling process (i.e. additively manufactured coatings and parts). Developing a robust database for Pb-free solderability behavior is also necessary, as industry transitions from tin-lead (SnPb) to lead free (Pb-free) solders.